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Plasma-Surface Interactions and Processing of Materials

  • Book
  • © 1990

Overview

Editors:
  1. Orlando Auciello

    1. Microelectronics Center of North Carolina, Research Triangle Park, USA
      North Carolina State University, Research Triangle Park, USA

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  2. Alberto Gras-Marti
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  3. Jose Antonia Valles-Abarca

    1. University of Alicante, Alicante, Spain

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  4. Daniel L. Flamm

    1. AT&T Bell Laboratories, Murray Hill, USA
      University of California, Berkeley, USA

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Part of the book series: NATO Science Series E: (NSSE, volume 176)

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Table of contents (44 chapters)

  1. Front Matter

    Pages i-xiii
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  2. Basic Physics of Plasmas/Discharges: Production of Active Species

    • A. Ricard
    Pages 1-34

  3. Plasma Chemistry in Etching

    • Daniel L. Flamm
    Pages 35-55

  4. Optical Diagnostic Techniques for Low Pressure Plasma Processing

    • V. M. Donnelly
    Pages 57-93

  5. Measuring EEDF in Gas Discharge Plasmas

    • V. A. Godyak
    Pages 95-134

  6. Transport Phenomena in Plasma Processing

    • Alberto Gras-Martí, José-Antonio Vallés-Abarca, Juan-Carlos Moreno-Marín
    Pages 135-146

  7. Kinetics of a Low-Pressure H2 Multipole Discharge Used for GaAs Treatment

    • J. Bretagne, D. Jacquin, R. Ferdinand
    Pages 147-150

  8. Ar and Ti Excited States in the Vicinity of the Substrate during Magnetron Sputtering of Ti

    • T. Pech, A. Ricard
    Pages 151-154

  9. Modeling of the Plasma Nitriding Process

    • J. L. Marchand, H. Michel, D. Ablitzer, M. Gantois, A. Ricard, J. Szekely
    Pages 155-158

  10. Plasma Measurements in a Magnetron Sputtering Device

    • J. B. Almeida, F. Guimaraes, M. M. D. Ramos
    Pages 159-162

  11. Laser-Induced Fluorescence Measurements of Ion Distribution Functions

    • J. Goree, M. J. Goeckner
    Pages 163-165

  12. Laser Induced Fluorescence Measurements in Plasma Etching Processes

    • J. P. Booth, G. Hancock, N. D. Perry, M. J. Toogood
    Pages 167-169

  13. Effect of Modulation on the Plasma Deposition of Hydro-Genated and Fluorinated Silicon Nitride

    • G. Cicala, D. L. Flamm, D. E. Ibbotson, J. A. Mucha
    Pages 171-173

  14. Partial Pressure Analysis of CF4/O2 Plasmas

    • J. C. Martz, D. W. Hess, W. E. Anderson
    Pages 175-178

  15. Surface Characterization of Corona Discharge Treated Poly(Ethylene Terephthalate)

    • Y. De Puydt, P. Bertrand, Y. Novis, M. Chtaib, P. Lutgen, G. Feyder
    Pages 179-183

  16. The Physics of the Sputter Erosion Process

    • Herbert M. Urbassek
    Pages 185-199

  17. Basic Phenomena in Reactive Etching of Materials

    • Orlando Auciello
    Pages 201-249

  18. Particle Bombardment Effects in Thin Film Deposition

    • James M. E. Harper
    Pages 251-280

  19. Low-Energy Ion/Surface Interactions during Film Growth from the Vapor Phase: Effects on Nucleation and Growth Kinetics, Defect Structure, and Elemental Incorporation Probabilities

    • J. E. Greene, S. A. Barnett, J.-E. Sundgren, A. Rockett
    Pages 281-311

  20. Low-Energy Accelerated-Ion Doping of Si during Molecular Beam Epitaxy: Incorporation Probabilities, Depth Distributions, and Electrical Properties

    • L. C. Markert, J. Knall, J.-P. Noel, M.-A. Hasan, J. E. Greene, J.-E. Sundgren
    Pages 313-316
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Keywords

About this book

An understanding of the processes involved in the basic and applied physics and chemistry of the interaction of plasmas with materials is vital to the evolution of technologies such as those relevant to microelectronics, fusion and space.
The subjects dealt with in the book include: the physics and chemistry of plasmas, plasma diagnostics, physical sputtering and chemical etching, plasma assisted deposition of thin films, ion and electron bombardment, and plasma processing of inorganic and polymeric materials.
The book represents a concentration of a substantial amount of knowledge acquired in this area - knowledge which was hitherto widely scattered throughout the literature - and thus establishes a baseline reference work for both established and tyro research workers.

Editors and Affiliations

  • Microelectronics Center of North Carolina, Research Triangle Park, USA

    Orlando Auciello

  • North Carolina State University, Research Triangle Park, USA

    Orlando Auciello

  • University of Alicante, Alicante, Spain

    Jose Antonia Valles-Abarca

  • AT&T Bell Laboratories, Murray Hill, USA

    Daniel L. Flamm

  • University of California, Berkeley, USA

    Daniel L. Flamm

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