Electronics Packaging Forum

1. Front Matter

   Pages i-viii

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2. An Introduction to Tape Automated Bonding Technology

   • John H. Lau, Steve J. Erasmus, Donald W. Rice

   Pages 1-83

3. Stress Analysis for Component-Populated Circuit Cards

   • Peter A. Engel

   Pages 85-102

4. Modeling Concepts for the Vibration Analysis of Circuit Cards

   • James M. Pitarresi

   Pages 103-137

5. Power Technology Packaging for the 90s

   • Craig D. Smith

   Pages 139-181

6. Recent Developments in Thermal Technology for Electronics Packaging

   • Richard C. Chu, Robert E. Simons

   Pages 183-208

7. Heat Sinks in Forced Convection Cooling

   • Gary L. Lehmann

   Pages 209-228

8. Diamond Thin Films: Applications in Electronics Packaging

   • Lynn Sui-Yuan, D. Garg, D. S. Hoover

   Pages 229-245

9. Low Dielectric Constant Materials for Packaging High Speed Electronics

   • Melvin P. Zussman

   Pages 247-280

10. Integrated Optical Devices Based on Silica Waveguide Technology

    • Tadashi Miyashita

    Pages 281-295

11. Electrostatic and Electrical Overstress Damage in Silicon Mosfet Devices and Gaas Mesfet Structures

    • David S. Campbell, Vincent M. Dwyer

    Pages 297-333

12. Cleaning Surface Mount Assemblies: The Challenge of Finding a Substitute for CFC-113

    • J. Kirk Bonner

    Pages 335-361

13. Electrical Bonding of Connectors on Jet Engine Electronics

    • Stephan J. Meschter

    Pages 363-394

14. Parameterization of Fine Pitch Processing

    • George R. Westby, Michael D. Snyder

    Pages 395-436

15. Microelectronics Packaging/Interconnect: An Industry in Transition

    • Daniel C. Blazej

    Pages 437-449

16. Back Matter

    Pages 451-459

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Each May, the Continuing Education Division of the T.J.Watson School of Engineering, Applied Science and Technology at the State University of New York at Binghamton sponsors an Annual Symposium in Electronics Packaging in cooperation with local professional societies (IEEE, ASME, SME, IEPS) and UnlPEG (the University-Industry Partnership for Economic Growth.) Each volume of this Electronics Packaging Forum series is based on the the preceding Symposium, with Volume Two based on the 1990 presentations. The Preface to Volume One included a brief definition of the broad scope of the electronics packaging field with some comments on why it has recently assumed such a more prominent priority for research and development. Those remarks will not be repeated here; at this point it is assumed that the reader is a professional in the packaging field, or possibly a student of one of the many academic disciplines which contribute to it. It is worthwhile repeating the series objectives, however, so the reader will be clear as to what might be expected by way of content and level of each chapter.

• circuit
• development
• electrical overstress (EOS)
• electronics
• heat
• material
• photon

• State University of New York, Binghamton, USA

  James E. Morris

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