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Electronics Packaging Forum

Volume Two

  • Book
  • © 1991

Overview

Editors:
  1. James E. Morris

    1. State University of New York, Binghamton, USA

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Table of contents (14 chapters)

  1. Front Matter

    Pages i-viii
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  2. An Introduction to Tape Automated Bonding Technology

    • John H. Lau, Steve J. Erasmus, Donald W. Rice
    Pages 1-83

  3. Stress Analysis for Component-Populated Circuit Cards

    • Peter A. Engel
    Pages 85-102

  4. Modeling Concepts for the Vibration Analysis of Circuit Cards

    • James M. Pitarresi
    Pages 103-137

  5. Power Technology Packaging for the 90s

    • Craig D. Smith
    Pages 139-181

  6. Recent Developments in Thermal Technology for Electronics Packaging

    • Richard C. Chu, Robert E. Simons
    Pages 183-208

  7. Heat Sinks in Forced Convection Cooling

    • Gary L. Lehmann
    Pages 209-228

  8. Diamond Thin Films: Applications in Electronics Packaging

    • Lynn Sui-Yuan, D. Garg, D. S. Hoover
    Pages 229-245

  9. Low Dielectric Constant Materials for Packaging High Speed Electronics

    • Melvin P. Zussman
    Pages 247-280

  10. Integrated Optical Devices Based on Silica Waveguide Technology

    • Tadashi Miyashita
    Pages 281-295

  11. Electrostatic and Electrical Overstress Damage in Silicon Mosfet Devices and Gaas Mesfet Structures

    • David S. Campbell, Vincent M. Dwyer
    Pages 297-333

  12. Cleaning Surface Mount Assemblies: The Challenge of Finding a Substitute for CFC-113

    • J. Kirk Bonner
    Pages 335-361

  13. Electrical Bonding of Connectors on Jet Engine Electronics

    • Stephan J. Meschter
    Pages 363-394

  14. Parameterization of Fine Pitch Processing

    • George R. Westby, Michael D. Snyder
    Pages 395-436

  15. Microelectronics Packaging/Interconnect: An Industry in Transition

    • Daniel C. Blazej
    Pages 437-449

  16. Back Matter

    Pages 451-459
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Keywords

About this book

Each May, the Continuing Education Division of the T.J.Watson School of Engineering, Applied Science and Technology at the State University of New York at Binghamton sponsors an Annual Symposium in Electronics Packaging in cooperation with local professional societies (IEEE, ASME, SME, IEPS) and UnlPEG (the University-Industry Partnership for Economic Growth.) Each volume of this Electronics Packaging Forum series is based on the the preceding Symposium, with Volume Two based on the 1990 presentations. The Preface to Volume One included a brief definition of the broad scope of the electronics packaging field with some comments on why it has recently assumed such a more prominent priority for research and development. Those remarks will not be repeated here; at this point it is assumed that the reader is a professional in the packaging field, or possibly a student of one of the many academic disciplines which contribute to it. It is worthwhile repeating the series objectives, however, so the reader will be clear as to what might be expected by way of content and level of each chapter.

Editors and Affiliations

  • State University of New York, Binghamton, USA

    James E. Morris

Bibliographic Information

  • Book Title: Electronics Packaging Forum

  • Book Subtitle: Volume Two

  • Editors: James E. Morris

  • DOI: https://doi.org/10.1007/978-94-009-0439-2

  • Publisher: Springer Dordrecht

  • eBook Packages: Springer Book Archive

  • Copyright Information: Van Nostrand Reinhold 1991

  • Hardcover ISBN: 978-0-442-00476-7Due: 17 January 1991

  • Softcover ISBN: 978-94-010-6681-5Published: 09 October 2011

  • eBook ISBN: 978-94-009-0439-2Published: 06 December 2012

  • Edition Number: 1

  • Number of Pages: VIII, 460

  • Topics: Electronics and Microelectronics, Instrumentation, Physics, general

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