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Technology of Integrated Circuits

  • Book
  • © 2000

Overview

Authors:
  1. Dietrich Widmann

    1. semiconductor technology development, Infineon Technologies, Munich, Germany

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  2. Hermann Mader

    1. Department of Electrical Engineering and Information Technologies, Munich University of Applied Sciences, Munich, Germany

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  3. Hans Friedrich

    1. TELA Versicherungs AG, Munich, Germany

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  4. Walter Heywang

    1. Technical University Munich, Munich, Germany

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  5. Rudolf Müller

    1. Technical University Munich, Munich, Germany

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  • This is the first book in which the tremendous developments of the recent years are recorded
  • The authors played active roles in the research projects which lead to this new technologies
  • Revised translation of a well-established German graduate textbook
  • Includes supplementary material: sn.pub/extras

Part of the book series: Springer Series in Advanced Microelectronics (MICROELECTR., volume 2)

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Table of contents (8 chapters)

  1. Front Matter

    Pages I-XVIII
    Download chapter PDF

  2. Introduction

    • Dietrich Widmann, Hermann Mader, Hans Friedrich, Walter Heywang, Rudolf Müller
    Pages 1-2

  3. Basic principles of integrated circuit technology

    • Dietrich Widmann, Hermann Mader, Hans Friedrich, Walter Heywang, Rudolf Müller
    Pages 3-11

  4. Film technology

    • Dietrich Widmann, Hermann Mader, Hans Friedrich, Walter Heywang, Rudolf Müller
    Pages 13-93

  5. Lithography

    • Dietrich Widmann, Hermann Mader, Hans Friedrich, Walter Heywang, Rudolf Müller
    Pages 95-167

  6. Etching technology

    • Dietrich Widmann, Hermann Mader, Hans Friedrich, Walter Heywang, Rudolf Müller
    Pages 169-206

  7. Doping technology

    • Dietrich Widmann, Hermann Mader, Hans Friedrich, Walter Heywang, Rudolf Müller
    Pages 207-234

  8. Cleaning technology

    • Dietrich Widmann, Hermann Mader, Hans Friedrich, Walter Heywang, Rudolf Müller
    Pages 235-248

  9. Process integration

    • Dietrich Widmann, Hermann Mader, Hans Friedrich, Walter Heywang, Rudolf Müller
    Pages 249-322

  10. Back Matter

    Pages 323-340
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Keywords

About this book

Strongly involved with SIEMENS Corp. in the tremendous recent developments of process technologies for IC fabrication the authors comprehensively record their authoritative knowledge and practical experience. New materials , modern planar technology, process designs for CMOS, Bipolar, BICMOS and smart-power technologies, self-adjusting doping techniques are just a few of the highlights. With its strong application-orientation this is a need-to-have book for professionals in semiconductor industries. Senior students in electrical engineering and physics can use it as a textbook because of the systematic treatment of the subjects. With regard to their later careers as industrial engineers they will particularly appreciate the deep insight into the actual methods and problems of IC manufacturing.

Authors and Affiliations

  • semiconductor technology development, Infineon Technologies, Munich, Germany

    Dietrich Widmann

  • Department of Electrical Engineering and Information Technologies, Munich University of Applied Sciences, Munich, Germany

    Hermann Mader

  • TELA Versicherungs AG, Munich, Germany

    Hans Friedrich

  • Technical University Munich, Munich, Germany

    Walter Heywang, Rudolf Müller

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