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Ultraclean Surface Processing of Silicon Wafers

Secrets of VLSI Manufacturing

  • Book
  • © 1998

Overview

Editors:
  1. Takeshi Hattori

    1. ULSI R&D Laboratories, Sony Corporation Semiconductor Company, Atsugi, Japan

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  • Handbook on most advanced technologies in surface processing of silicon wafers.

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Table of contents (46 chapters)

  1. Front Matter

    Pages I-XXVIII
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  2. Introduction

    1. Front Matter

      Pages 1-1
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    2. Ultraclean Technology for VLSI Manufacturing: An Overview

      • Takeshi Hattori
      Pages 3-17

  3. Influence of Contamination on Silicon Device Characteristics

    1. Front Matter

      Pages 19-19
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    2. Influence of Silicon Crystal Quality on Device Characteristics

      • Yoshinobu Monma
      Pages 21-28

    3. Influence of Contaminants on Device Characteristics

      • Jun Sugiura
      Pages 29-41

    4. Influence of Metallic Contamination on Dielectric Degradation of MOS Structures

      • Makoto Takiyama
      Pages 42-56

    5. Influence of Micro-Roughness on Device Characteristics

      • Takashi Futatsuki
      Pages 57-64

  4. Mechanisms of Particle Adhesion on Wafer Surfaces

    1. Front Matter

      Pages 65-65
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    2. Particle Deposition in Air

      • Motoaki Adachi, Kikuo Okuyama
      Pages 67-81

    3. Particle Deposition in Plasma

      • Motoaki Adachi, Kikuo Okuyama
      Pages 82-91

    4. Particle Deposition in Vacuum

      • Tetsuro Kodama
      Pages 92-104

    5. Particle Adhesion in Liquids

      • Akio Saito, Katsuhiro Ota
      Pages 105-114

    6. Particle Adhesion and Removal on Wafer Surfaces in RCA Cleaning

      • Mitsushi Itano, Takehiko Kezuka
      Pages 115-136

    7. Effects of Electrostatic Charge on Particle Adhesion on Wafer Surfaces

      • Hitoshi Inaba
      Pages 137-150

  5. Analysis and Evaluation of Silicon Wafer Surfaces: Fundamentals

    1. Front Matter

      Pages 151-151
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    2. Measurement of Particles on Wafer Surfaces

      • Motosuke Miyoshi
      Pages 153-167

    3. Analysis and Evaluation of Impurities on Wafer Surfaces

      • Ayako Shimazaki
      Pages 168-178

    4. Analysis and Evaluation of Molecules Adhered to Wafer Surfaces

      • Norikuni Yabumoto
      Pages 179-193

    5. Electrical Evaluation of Metallic Impurities on Wafer Surfaces

      • Morimasa Miyazaki
      Pages 194-222
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Keywords

About this book

A totally new concept for clean surface processing of Si wafers is introduced in this book. Some fifty distinguished researchers and engineers from the leading Japanese semiconductor companies, such as NEC, Hitachi, Toshiba, Sony and Panasonic as well as from several universities reveal to us for the first time the secrets of these highly productive institutions. They describe the techniques and equipment necessary for the preparation of clean high-quality semiconductor surfaces as a first step in high-yield/high-quality device production. This book thus opens the door to the manufacturing of reliable nanoscale devices and will be extremely useful for every engineer, physicist and technician involved in the production of silicon semiconductor devices.

Editors and Affiliations

  • ULSI R&D Laboratories, Sony Corporation Semiconductor Company, Atsugi, Japan

    Takeshi Hattori

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