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Ion Implantation Techniques

Lectures given at the Ion Implantation School in Connection with Fourth International Conference on Ion Implantation: Equipment and Techniques Berchtesgaden, Fed. Rep. of Germany, September 13–15, 1982

  • Conference proceedings
  • © 1982

Overview

Editors:
  1. Heiner Ryssel

    1. Frauenhofer — Institut für Festkörpertechnologie, München 60, Fed. Rep. of Germany

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  2. Hans Glawischnig

    1. Siemens AG, München 80, Fed. Rep. of Germany

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    You can also search for this editor in PubMed   Google Scholar

Part of the book series: Springer Series in Electronics and Photonics (SSEP, volume 10)

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Table of contents (16 papers)

  1. Front Matter

    Pages I-XII
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  2. Machine Aspects of Ion Implantation

    1. Front Matter

      Pages 1-1
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    2. Ion Implantation System Concepts

      • Hans Glawischnig
      Pages 3-21

    3. Ion Sources

      • D. Aitken
      Pages 23-71

    4. Faraday Cup Designs for Ion Implantation

      • Charles M. McKenna
      Pages 73-103

    5. Safety and Ion Implanters

      • R. Bustin, P. H. Rose
      Pages 105-120

  3. Ion Ranges in Solids

    1. Front Matter

      Pages 121-121
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    2. The Stopping and Range of Ions in Solids

      • J. P. Biersack, J. F. Ziegler
      Pages 122-156

    3. The Calculation of Ion Ranges in Solids with Analytic Solutions

      • J. P. Biersack, J. F. Ziegler
      Pages 157-176

    4. Range Distributions

      • Heiner Ryssel
      Pages 177-205

  4. Measuring Techniques and Annealing

    1. Front Matter

      Pages 207-207
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    2. Electrical Measuring Techniques

      • P. L. F. Hemment
      Pages 209-234

    3. Wafer Mapping Techniques for Characterization of Ion Implantation Processing

      • M. I. Current, D. S. Perloff, L. S. Gutai
      Pages 235-253

    4. Non-Electrical Measuring Techniques

      • P. Eichinger, H. Ryssel
      Pages 255-297

    5. Annealing and Residual Damage

      • Siegfried Mader
      Pages 299-316

  5. Appendix: Modern Ion Implantation Equipment

    1. Front Matter

      Pages 317-317
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    2. Evolution and Performance of the Nova NV-ID Predep™ Implanter

      • G. Ryding
      Pages 319-342

    3. Ion Implantation Equipment from Veeco

      • W. A. Scaife, K. Westphal
      Pages 343-350

    4. The Series IIIA and IIIX Ion Implanters

      • D. Aitken
      Pages 351-358

    5. Standard High-Voltage Power Supplies for Ion Implantation

      • M. Baumann
      Pages 359-360
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Keywords

Editors and Affiliations

  • Frauenhofer — Institut für Festkörpertechnologie, München 60, Fed. Rep. of Germany

    Heiner Ryssel

  • Siemens AG, München 80, Fed. Rep. of Germany

    Hans Glawischnig

Bibliographic Information

  • Book Title: Ion Implantation Techniques

  • Book Subtitle: Lectures given at the Ion Implantation School in Connection with Fourth International Conference on Ion Implantation: Equipment and Techniques Berchtesgaden, Fed. Rep. of Germany, September 13–15, 1982

  • Editors: Heiner Ryssel, Hans Glawischnig

  • Series Title: Springer Series in Electronics and Photonics

  • DOI: https://doi.org/10.1007/978-3-642-68779-2

  • Publisher: Springer Berlin, Heidelberg

  • eBook Packages: Springer Book Archive

  • Copyright Information: Springer-Verlag Berlin Heidelberg 1982

  • Softcover ISBN: 978-3-642-68781-5Published: 07 December 2011

  • eBook ISBN: 978-3-642-68779-2Published: 06 December 2012

  • Series ISSN: 0172-5734

  • Edition Number: 1

  • Number of Pages: XII, 374

  • Topics: Crystallography and Scattering Methods, Surfaces and Interfaces, Thin Films, Engineering, general

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