Low Dielectric Constant Materials for IC Applications

1. Front Matter

   Pages I-XIX

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2. Overview on Low Dielectric Constant Materials for IC Applications

   • P. S. Ho, J. Leu, W. W. Lee

   Pages 1-21

3. Materials Issues and Characterization of Low-k Dielectric Materials

   • E. T. Ryan, A. J. McKerrow, J. Leu, P. S. Ho

   Pages 23-74

4. Structure and Property Characterization of Low-k Dielectric Porous Thin Films Determined by X-Ray Reflectivity and Small-Angle Neutron Scattering

   • E. K. Lin, H. Lee, B. J. Bauer, H. Wang, J. T. Wetzel, W. Wu

   Pages 75-93

5. Vapor Deposition of Low-k Polymeric Dielectrics

   • W. N. Gill, S. Rogojevic, T. Lu

   Pages 95-119

6. Plasma-Enhanced Chemical Vapor Deposition of FSG and a-C:F Low-k Materials

   • K. Endo, K. Kishimoto, Y. Matsubara, K. Koyanagi

   Pages 121-166

7. Porous Organosilicates for On-Chip Applications: Dielectric Generational Extendibility by the Introduction of Porosity

   • W. Volksen, C. J. Hawker, J. L. Hedrick, V. Lee, T. Magbitang, M. Toney et al.

   Pages 167-202

8. Metal/Polymer Interfacial Interactions

   • D. M. Martini, J. A. Kelber

   Pages 203-220

9. Diffusion Of Metals In Polymers And During Metal/Polymer Interface Formation

   • F. Faupel, A. Thran, M. Kiene, T. Strunskus, V. Zaporojtchenko, K. Behnke

   Pages 221-251

10. Plasma Etching of Low Dielectric Constant Materials

    • G. S. Oehrlein, T. E. F. M. Standaert, P. J. Matsuo

    Pages 253-276

11. Integration of SiLK Semiconductor Dielectric

    • Joost J. Waeterloos

    Pages 277-304

12. Back Matter

    Pages 305-309

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Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for < 0.18 um process technology. Topics include: Organic dielectric materials, Inorganic dielectric materials, Composite dielectric materials, Metrology and characterization techniques, Integration, Reliability. This volume will be an invaluable resource for professionals, scientists, researchers and graduate students involved in dielectric technology development, materials science, polymer science, and semiconductor devices and processing.

• Dielectric Materials
• Integrated circuit manufacture
• Interconnects
• Low dielectric constant
• Permittivity
• Semiconductor
• integrated circuit
• packaging
• plasma etching
• thin film

From the reviews:

Praise for P.S. Ho, J. Leu, and W.W. Lee, Ed's, Low Dielectric Constant Materials for IC Applications

Electrical Insulation Magazine

"Because this volume contains an excellent overview of the current research and issues with low-k dielectric materials for IC applications along with comprehensive practical information, researches, material scientists, and polymer engineers working in the area of microelectronics will find this book a very valuable addition to their library."

"This text addresses the latest advances in low-k materials, thin film characterization, integration into copper interconnection processing, and reliability for microelectronics applications. … Because this volume contains an excellent overview of the current research and issues with low-k dielectric materials for IC applications along with comprehensive practical information, researchers, material scientists, and polymer engineers working in the area of microelectronics will find this book a very valuable addition to their library." (IEEE Electrical Insulation Magazine, Vol. 20 (2), March/April, 2004)

"This book addresses issues on the development, characterization and integration of low dielectric constant (k) materials for advanced on-chip interconnects. … this book illustrates in a comprehensive way the technological challenges brought by the introduction of low-k materials into semiconductor manufacturing. … Being intended to researchers and engineers active in the field of semiconductor processing, it can be used as an introductory book … . Highly appreciated." (Jean - Francois de Marneffe, Physicalia, Vol. 25 (4), 2003)

• Texas Materials Institute, The University of Texas at Austin, Austin, USA

  Paul S. Ho

• Intel Corp., MS: RA1-204, Hillsboro, USA

  Jihperng Jim Leu

• Taiwan Semiconductor Manufacturing Co. (TSMC), Hsin-chu, Taiwan

  Wei William Lee

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