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Silicon Microchannel Heat Sinks

Theories and Phenomena

  • Book
  • © 2004

Overview

Authors:
  1. Lian Zhang

    1. Molecular Nanosystems, Palo Alto, USA

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  2. Kenneth E. Goodson

    1. Department of Mechanical Engineering, Stanford University, Stanford, USA

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  3. Thomas W. Kenny

    1. Department of Mechanical Engineering, Stanford University, Stanford, USA

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  • Heat sinks is a topic related to functioning of electronic microdevices
  • This topic is systematically presented in this book for the first time
  • Includes supplementary material: sn.pub/extras

Part of the book series: Microtechnology and MEMS (MEMS)

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Table of contents (7 chapters)

  1. Front Matter

    Pages I-IX
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  2. Introduction

    • Lian Zhang, Kenneth E. Goodson, Thomas W. Kenny
    Pages 1-11

  3. Two-phase Microchannel Heat Sinks: Problems and Challenges

    • Lian Zhang, Kenneth E. Goodson, Thomas W. Kenny
    Pages 13-32

  4. A Thermal Experimental System with Freestanding Microchannels

    • Lian Zhang, Kenneth E. Goodson, Thomas W. Kenny
    Pages 33-54

  5. Measurements and Modeling of Two-phase Flow in Microchannels

    • Lian Zhang, Kenneth E. Goodson, Thomas W. Kenny
    Pages 55-72

  6. Boiling Regimes and Transient Signals Associated with the Phase Change

    • Lian Zhang, Kenneth E. Goodson, Thomas W. Kenny
    Pages 73-94

  7. Enhanced Nucleate Boiling in Microchannels

    • Lian Zhang, Kenneth E. Goodson, Thomas W. Kenny
    Pages 95-118

  8. Conclusions

    • Lian Zhang, Kenneth E. Goodson, Thomas W. Kenny
    Pages 119-125

  9. Back Matter

    Pages 127-141
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Keywords

About this book

There is significant current interest in new technologies for IC (Integrated Circuit) cooling, driven by the rapid increase in power densities in ICs and the trend towards high-density electronic packaging for applications throughout civilian and military markets. In accordance with Moore's Law, the number of transistors on 6 Intel Pentium microprocessors has increased from 7.5 x10 in 1997 (Pentium II) to 6 55 x10 in 2002 (Pentium 4). Considering the rapid increase in the integration density, thermal management must be well designed to ensure proper functionality of these high-speed, high-power chips. Forced air convection has been traditionally used to remove the heat through a finned heat sink and fan module. 2 Currently, with 82 W power dissipation rate, approximately 62 W/cm heat flux, from a Pentium 4 processor with 3.06 GHz core frequency, the noise generated from high rotating speed fans is approaching the limit of acceptable level for humans. However, the power dissipation from a single cost-performance chip is 2 expected to exceed 100 W/cm by the year 2005, when the air cooling has to be replaced by new cooling technologies. Among alternative cooling methods, the two-phase microchannel heat sink is one of the most promising solutions. Understanding the boiling process and the two-phase flow behavior in microchannels is the key to successful implementation of such a device.

Authors and Affiliations

  • Molecular Nanosystems, Palo Alto, USA

    Lian Zhang

  • Department of Mechanical Engineering, Stanford University, Stanford, USA

    Kenneth E. Goodson, Thomas W. Kenny

Bibliographic Information

  • Book Title: Silicon Microchannel Heat Sinks

  • Book Subtitle: Theories and Phenomena

  • Authors: Lian Zhang, Kenneth E. Goodson, Thomas W. Kenny

  • Series Title: Microtechnology and MEMS

  • DOI: https://doi.org/10.1007/978-3-662-09899-8

  • Publisher: Springer Berlin, Heidelberg

  • eBook Packages: Springer Book Archive

  • Copyright Information: Springer-Verlag Berlin Heidelberg 2004

  • Hardcover ISBN: 978-3-540-40181-0Published: 26 November 2003

  • Softcover ISBN: 978-3-642-07282-6Published: 10 April 2011

  • eBook ISBN: 978-3-662-09899-8Published: 14 March 2013

  • Series ISSN: 1615-8326

  • Series E-ISSN: 2365-0680

  • Edition Number: 1

  • Number of Pages: IX, 141

  • Number of Illustrations: 92 b/w illustrations, 4 illustrations in colour

  • Topics: Electronics and Microelectronics, Instrumentation, Condensed Matter Physics, Engineering, general

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