Overview
- A new integration scheme considering both performance and yield
- Novel cost model to compare difference integration styles
- Design driven approach to prove the performance advantages of 2.5/3-D IC's
- Full EDA tool support for 3-D layout creation
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Table of contents (8 chapters)
Keywords
About this book
"3-Dimensional VLSI: A 2.5-Dimensional Integration Scheme"elaborates the concept and importance of 3-Dimensional (3-D) VLSI. The authors have developed a new 3-D IC integration paradigm, so-called 2.5-D integration, to address many problems that are hard to resolve using traditional non-monolithic integration schemes. The book also introduces major 3-D VLSI design issues that need to be solved by IC designers and Electronic Design Automation (EDA) developers. By treating 3-D integration in an integrated framework, the book provides important insights for semiconductor process engineers, IC designers, and those working in EDA R&D.
Dr. Yangdong Deng is an associate professor at the Institute of Microelectronics, Tsinghua University, China. Dr. Wojciech P. Maly is the U. A. and Helen Whitaker Professor at the Department of Electrical and Computer Engineering, Carnegie Mellon University, USA.
Authors and Affiliations
Bibliographic Information
Book Title: 3-Dimensional VLSI
Book Subtitle: A 2.5-Dimensional Integration Scheme
Authors: Yangdong Deng, Wojciech P. Maly
DOI: https://doi.org/10.1007/978-3-642-04157-0
Publisher: Springer Berlin, Heidelberg
eBook Packages: Engineering, Engineering (R0)
Copyright Information: Springer-Verlag Berlin Heidelberg 2010
Hardcover ISBN: 978-3-642-04156-3Due: 21 June 2010
eBook ISBN: 978-3-642-04157-0Published: 08 September 2010
Edition Number: 1
Number of Pages: 200
Number of Illustrations: 50 b/w illustrations
Additional Information: Jointly published with Tsinghua University Press
Topics: Circuits and Systems