Low Pressure Plasmas and Microstructuring Technology

1. Front Matter

   Pages i-xxii

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2. Introduction

   • Gerhard Franz

   Pages 1-3

3. Collisions and cross sections

   • Gerhard Franz

   Pages 5-40

4. The plasma

   • Gerhard Franz

   Pages 41-67

5. DC discharges

   • Gerhard Franz

   Pages 69-101

6. High-frequency discharges I

   • Gerhard Franz

   Pages 103-149

7. High-frequency discharges II

   • Gerhard Franz

   Pages 151-213

8. High-frequency discharges III

   • Gerhard Franz

   Pages 215-267

9. Ion beam systems

   • Gerhard Franz

   Pages 269-297

10. Plasma diagnostics

    • Gerhard Franz

    Pages 299-374

11. Plasma deposition processes

    • Gerhard Franz

    Pages 375-438

12. Plasma etch processes

    • Gerhard Franz

    Pages 439-515

13. Etch Mechanisms

    • Gerhard Franz

    Pages 517-557

14. Outlook

    • Gerhard Franz

    Pages 559-565

15. Advanced Topics

    • Gerhard Franz

    Pages 567-659

16. Back Matter

    Pages 1-63

    PDF

Over the last forty years, plasma supported processes have attracted ever - creasing interest, and now, all modern semiconductor devices undergo at least one plasma-involved processing step, starting from surface cleaning via coating to etching. In total, the range of the treated substrates covers some orders of magnitude: Trenches and linewidths of commercially available devices have - ready passed the boundary of 100 nm, decorative surface treatment will happen 2 in the mm range, and the upper limit is reached with surface protecting layers of windows which are coated with ?/4 layers against IR radiation. The rapid development of the semiconductor industry is inconceivable wi- outthegiantprogressintheplasmatechnology.Moore’slawisnotcarvedinto 1 stone, and not only the ITRS map is subject to change every ?ve years but also new branches develop and others mingle together. Moreover, the quality of conventional materials can be improved by plasma treatment:Cottonbecomesmorecrease-resistant,leathermoredurable,andthe shrinking of wool ?bers during the washing process can be signi?cantly reduced. To cut a long story short: More than 150 years after the discovery of the sputtering e?ect by Grove, plasma-based processes are about to spread out into new ?elds of research and application [1]—no wonder that the market for etching machines kept growing by an annual rate of 17 % up to the burst of the internet bubble, and it took only some years of recovery to continue the voyage [2].

• Cross section
• Diagnostics
• Discharges
• Etching
• Ion Beam
• Microelectronics
• Nanoelectronics
• Nanoimprint
• Sputtering
• collision

• FB 06 Feinwerk- und Mikrotechnik, Hochschule München, München, Germany

  Gerhard Franz

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