Skip to main content
  • Book
  • © 2005

CCD Image Sensors in Deep-Ultraviolet

Degradation Behavior and Damage Mechanisms

  • The first book to integrate CCD image sensor characteristics, their intrinsic instabilities, and the effect of UV radiation on device characteristics

Part of the book series: Microtechnology and MEMS (MEMS)

Buy it now

Buying options

eBook USD 129.00
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book USD 169.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info
Hardcover Book USD 169.99
Price excludes VAT (USA)
  • Durable hardcover edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Other ways to access

This is a preview of subscription content, log in via an institution to check for access.

Table of contents (14 chapters)

  1. Front Matter

    Pages I-XI
  2. Introduction

    Pages 1-4
  3. CCD Image Sensors

    1. Overview of CCD

      Pages 7-21
  4. Instabilities in Si, SiO2, and the Si-SiO2 Interface

    1. Silicon

      Pages 45-50
    2. Silicon Dioxide

      Pages 51-79
    3. Si-SiO2 Interface

      Pages 81-91
  5. Effects of Radiation on the Si-SiO2 System

  6. Interaction of UV Radiation with the Si-SiO2 System

    1. UV-Induced Effects in Si

      Pages 121-123
  7. Interaction of DUV Radiation with CCD Sensors

  8. Concluding Remarks & Future Research

    1. Concluding Remarks

      Pages 207-210
  9. Back Matter

    Pages 211-231

About this book

As the deep-ultraviolet (DUV) laser technology continues to mature, an increasing number of industrial and manufacturing applications are emerging. For example, the new generation of semiconductor inspection systems is being pushed to image at increasingly shorter DUV wavelengths to facilitate inspection of deep sub-micron features in integrated circuits. DUV-sensitive charge-coupled device (CCD) cameras are in demand for these applications. Although CCD cameras that are responsive at DUV wavelengths are now available, their long-term stability is still a major concern. This book describes the degradation mechanisms and long-term performance of CCDs in the DUV, along with new results of device performance at these wavelengths.

Authors and Affiliations

  • Electrical & Computer Engineering, University of Waterloo, Waterloo, Canada

    Flora M. Li, Arokia Nathan

About the authors

Flora Li received her Bachelor of Applied Science degree in Electrical Engineering from University of Waterloo, Canada, in 2002. She completed her MASc degree in Electrical Engineering at University of Waterloo in 2003, where her research focus was on the investigation of deep-UV sensitive CCD image sensors and the related radiation damage issues. She is currently pursuing her Ph.D. degree in the field of organic electronics and polymer TFTs, under the supervision of Prof. Arokia Nathan at the University of Waterloo.

Arokia Nathan received his PhD in Electrical Engineering from the University of Alberta, Edmonton, Alberta, Canada, in 1988, where he was engaged in research related to the physics and numerical modeling of semiconductor microsensors. In 1987, he joined LSI Logic Corp., Santa Clara, CA where he worked on advanced multichip packaging techniques and related issues. Subsequently, he was at the Institute of Quantum Electronics, ETH Zürich, Switzerland. In 1989, he joined the Department of Electrical and Computer Engineering, University of Waterloo, where he is currently a Professor. In 1995, he was a Visiting Professor at the Physical Electronics Laboratory, ETH Zürich. His present research interests lie in fabrication of devices, circuits, and systems using disordered semiconductor, including organic, materials on rigid and mechanically flexible substrates for large area electronics. He held the DALSA/NSERC industrial research chair in sensor technology, and is a recipient of the Natural Sciences and Engineering Research Council E.W.R. Steacie Fellowship. He has published extensively in the field of sensor technology and CAD, and thin film transistor electronics, and is a co-author of the book, Microtransducer CAD, published by Springer in 1999.

Bibliographic Information

Buy it now

Buying options

eBook USD 129.00
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book USD 169.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info
Hardcover Book USD 169.99
Price excludes VAT (USA)
  • Durable hardcover edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Other ways to access