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Nanopackaging

Nanotechnologies and Electronics Packaging

Editors:

  • Discusses the importance of computer modeling in nanopackaging and offers suggestions for implementation
  • Contains 12 new chapters from internationally recognized contributors, as well as updates in all existing chapters
  • Brings together a comprehensive overview of nanoscale electronics and systems and covers structures, nanoelectronics packaging and interconnects, and offers a roadmap for future trends

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eBook USD 169.00
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  • Read on any device
  • Instant download
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Softcover Book USD 219.99
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  • Dispatched in 3 to 5 business days
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Hardcover Book USD 219.99
Price excludes VAT (USA)
  • Durable hardcover edition
  • Dispatched in 3 to 5 business days
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Table of contents (32 chapters)

  1. Front Matter

    Pages i-xxviii
  2. Modelling Technologies and Applications

    • Chris Bailey, Stoyan Stoyanov, Hua Lu, Tim Tilford, Chunyan Yin, Nadia Strusevich
    Pages 45-82
  3. Advances in Delamination Modeling of Metal/Polymer Systems: Continuum Aspects

    • Olaf van der Sluis, Bart Vossen, Jan Neggers, Andre Ruybalid, Karthik Chockalingam, Ron Peerlings et al.
    Pages 83-128
  4. Advances in Delamination Modeling of Metal/Polymer Systems: Atomistic Aspects

    • Olaf van der Sluis, Nancy Iwamoto, Jianmin Qu, Shaorui Yang, Cadmus Yuan, Willem D. van Driel et al.
    Pages 129-183
  5. Soft Mold Nanoimprint: Modeling and Simulation

    • Yinsheng Zhong, Stephen C. T. Kwok, Matthew M. F. Yuen
    Pages 185-200
  6. Nanoparticle Properties

    • James E. Morris
    Pages 201-217
  7. Nanoparticle Fabrication

    • Masahiro Inoue, Yamato Hayashi, Hirotsugu Takizawa, Katsuaki Suganuma
    Pages 219-242
  8. Nanoparticle-Based High-k Dielectric Composites: Opportunities and Challenges

    • A. Dabrowski, Andrzej Dziedzic, Jiongxin Lu, C. P. Wong
    Pages 243-268
  9. Nanostructured Resistor Materials

    • Damian Nowak, Andrzej Dziedzic, Fan Wu, James E. Morris
    Pages 269-310
  10. Inductors: Micro- to Nanoscale Embedded Thin Power Inductors

    • P. Markondeya Raj, Gopal C. Jha, Sun Teng, Himani Sharma, Swapan K. Bhattacharya, Rao R. Tummala
    Pages 311-343
  11. Nano-conductive Adhesives

    • Daoqiang Daniel Lu, Yi Grace Li, C. P. Wong, James E. Morris
    Pages 345-367
  12. Nano-materials in Anisotropic Conductive Adhesives (ACAs)

    • Kyung-Wook Paik, Kyung-Lim Suk
    Pages 369-408
  13. Nanoparticles in Microvias

    • Rabindra N. Das, Frank D. Egitto
    Pages 409-437
  14. Nano-underfills and Potting Compounds for Fine-Pitch Electronics

    • Pradeep Lall, Saiful Islam, Kalyan Dornala, Jeff Suhling, Darshan Shinde
    Pages 513-574
  15. Carbon Nanotubes: Synthesis and Characterization

    • Nandhinee Radha Shanmugam, Shalini Prasad
    Pages 575-596
  16. Characteristics of Carbon Nanotubes for Nanoelectronic Device Applications

    • Nandhinee Radha Shanmugam, Shalini Prasad
    Pages 597-628

About this book

This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, applications of nanoparticles, graphene, carbon nanotubes and nanowires in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive “inks,” underfill fillers, and solder enhancement.

Now in a widely extended second edition, Nanopackaging is an important reference for industrial and academic researchers, as well as practicing engineers seeking information about latest techniques. Twelve new chapters address carbon nanotubes and nanowires, fabrication and properties of graphene, graphene for thermal cooling of microelectronics and for electrical interconnections, packaging of post-CMOS nanoelectronics, environmental and health effects of nanopackaging technologies, and more. This book is an ideal reference for researchers, practicing engineers, and graduate students who are either entering the field for the first time, or are already conducting research and want to expand their knowledge in the field of nanopackaging.



Editors and Affiliations

  • Department of Electrical and Computer Engineering, Portland State University, Portland, USA

    James E. Morris

About the editor

James E. Morris is Professor of Electrical & Computer Engineering at Portland State University, Oregon. He has edited or co-authored five books on electronic packaging, and has more on the way.

Bibliographic Information

  • Book Title: Nanopackaging

  • Book Subtitle: Nanotechnologies and Electronics Packaging

  • Editors: James E. Morris

  • DOI: https://doi.org/10.1007/978-3-319-90362-0

  • Publisher: Springer Cham

  • eBook Packages: Chemistry and Materials Science, Chemistry and Material Science (R0)

  • Copyright Information: Springer International Publishing AG, part of Springer Nature 2018

  • Hardcover ISBN: 978-3-319-90361-3Published: 02 October 2018

  • Softcover ISBN: 978-3-030-07999-4Published: 10 January 2019

  • eBook ISBN: 978-3-319-90362-0Published: 22 September 2018

  • Edition Number: 2

  • Number of Pages: XXVIII, 996

  • Number of Illustrations: 216 b/w illustrations, 419 illustrations in colour

  • Topics: Nanotechnology, Electronics and Microelectronics, Instrumentation, Electrochemistry

Buy it now

Buying options

eBook USD 169.00
Price excludes VAT (USA)
  • Available as EPUB and PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book USD 219.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info
Hardcover Book USD 219.99
Price excludes VAT (USA)
  • Durable hardcover edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Other ways to access