Overview
- Introduces a new and unique packaging technology
- Explains microelectromechanical systems (MEMS) packaging utilizing polymers or thin films
- Discusses finite element method (FEM) modeling to explain the technology from a theoretical perspective as well as offering practical information
Part of the book series: Springer Series in Advanced Manufacturing (SSAM)
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Table of contents (6 chapters)
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Front Matter
Keywords
About this book
This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films – a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure.
Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. Lastly, it includes the load–displacement curve of different materials and presents a flexible polymer filter and a tunable filter as examples of the applications of the proposed technology.Authors and Affiliations
Bibliographic Information
Book Title: Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering
Book Subtitle: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Authors: Seonho Seok
Series Title: Springer Series in Advanced Manufacturing
DOI: https://doi.org/10.1007/978-3-319-77872-3
Publisher: Springer Cham
eBook Packages: Engineering, Engineering (R0)
Copyright Information: Springer International Publishing AG 2018
Hardcover ISBN: 978-3-319-77871-6Published: 14 May 2018
Softcover ISBN: 978-3-030-08561-2Published: 05 January 2019
eBook ISBN: 978-3-319-77872-3Published: 27 April 2018
Series ISSN: 1860-5168
Series E-ISSN: 2196-1735
Edition Number: 1
Number of Pages: VIII, 115
Number of Illustrations: 106 b/w illustrations
Topics: Manufacturing, Machines, Tools, Processes, Nanotechnology, Nanotechnology and Microengineering, Characterization and Evaluation of Materials, Tribology, Corrosion and Coatings