RF and Microwave Microelectronics Packaging II

1. Front Matter

   Pages i-xii

   PDF

2. Introduction to Radio Frequency and Microwave Microelectronic Packaging

   • Rick Sturdivant

   Pages 1-17

3. Packaging of Transmit/Receive Modules

   • Rick Sturdivant

   Pages 19-32

4. 3D Transitions and Connections

   • Rick Sturdivant

   Pages 33-42

5. Electromagnetic Shielding for RF and Microwave Packages

   • Nozad Karim

   Pages 43-62

6. Design of C-Band Interdigital Filter and Compact C-Band Hairpin Bandpass Film Filter on Thin Film Substrate

   • Min Tan, Yang Xuan, Yong Ma, Li Li, Yonghe Zhuang

   Pages 63-73

7. Research on High-Reliable Low-Loss HTCC Technology Applied in Millimeter Wave SMT Package

   • Pang Xueman

   Pages 75-82

8. Chip Size Packaging (CSP) for RF MEMS Devices

   • Li Xiao, Honglang Li

   Pages 83-97

9. The Challenge in Packaging and Assembling the Advanced Power Amplifiers

   • Cai Liang, Jeff Burger

   Pages 99-112

10. High Thermal Conductivity Materials: Aluminum Diamond, Aluminum Silicon Carbide, and Copper Diamond

    • Kevin Loutfy, Birol Sonuparlak, Raouf Loutfy

    Pages 113-127

11. Advancement in High Thermal Conductive Graphite for Microelectronic Packaging

    • Wei Fan, Xiang Liu

    Pages 129-145

12. Carbon Nanotubes and Graphene for Microwave/RF Electronics Packaging

    • Xiaoxing Lu

    Pages 147-167

13. Erratum to: Chip Size Packaging (CSP) for RF MEMS Devices

    • Li Xiao, Honglang Li

    Pages E1-E1

14. Back Matter

    Pages 169-172

    PDF

This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.

• Microwave and millimeter-wave frequencies
• EMI shielding
• Chip size packaging for RF MEMS
• Ceramic and Laminate packaging
• High power electronics
• Thermal management system design
• Thin film substrate
• Advanced power amplifiers
• Millimeter wave circuit technology
• Quality control and failure analysis
• Waver level packaging
• System integration packaging technologies
• High thermal conductivity

• Torrey Hills Technologies, LLC, San Diego, USA

  Ken Kuang

• Azusa Pacific University, Azusa, USA

  Rick Sturdivant

Ken Kuang is President of Torrey Hills Technologies, LLC, a leader in the supply of quality microelectronics packaging components. From 2004-2013, Kuang led Torrey Hills to rank #188 in INC500 Fast Growing Private Companies in America and rank #2 in San Diego Business Journal 100 Fastest Growing Private Companies in San Diego. Kuang was three times the finalist for the Most Admired CEO in San Diego. 


Rick Sturdivant has been President of Microwave Packaging Technology, Inc. (MPT) since 2003. He regularly presents at conference workshops and other venues, and has been a guest lecturer at Georgia Tech Research Institute. He is a recognized expert in the field of Transmit/Receive (T/R) modules for phased array radar and communication systems.

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