Editors:
- Provides comprehensive coverage of the state-of-the-art in 3D microelectronic packages
- Covers advanced materials and processes, quality and reliability concerns, and fault isolation and failure analysis
- Discusses 3D electronic package architecture and assembly process design
- Features contributions from both academic and industry authors, for a complete view of this important technology
- Includes supplementary material: sn.pub/extras
Part of the book series: Springer Series in Advanced Microelectronics (MICROELECTR., volume 57)
Buy it now
Buying options
Tax calculation will be finalised at checkout
Other ways to access
This is a preview of subscription content, log in via an institution to check for access.
Table of contents (15 chapters)
-
Front Matter
-
Back Matter
About this book
Keywords
Editors and Affiliations
-
Intel Corporation, Chandler, USA
Yan Li, Deepak Goyal
Bibliographic Information
Book Title: 3D Microelectronic Packaging
Book Subtitle: From Fundamentals to Applications
Editors: Yan Li, Deepak Goyal
Series Title: Springer Series in Advanced Microelectronics
DOI: https://doi.org/10.1007/978-3-319-44586-1
Publisher: Springer Cham
eBook Packages: Engineering, Engineering (R0)
Copyright Information: Springer International Publishing AG, part of Springer Nature 2017
Softcover ISBN: 978-3-319-83086-5Published: 13 July 2018
eBook ISBN: 978-3-319-44586-1Published: 20 January 2017
Series ISSN: 1437-0387
Series E-ISSN: 2197-6643
Edition Number: 1
Number of Pages: IX, 463
Number of Illustrations: 78 b/w illustrations, 253 illustrations in colour
Topics: Electronics and Microelectronics, Instrumentation, Optical and Electronic Materials, Electronic Circuits and Devices, Microengineering, Nanotechnology and Microengineering, Metallic Materials