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3D Microelectronic Packaging

From Fundamentals to Applications

  • Book
  • © 2017

Overview

Editors:
  1. Yan Li

    1. Intel Corporation, Chandler, USA

    View editor publications

    You can also search for this editor in PubMed   Google Scholar

  2. Deepak Goyal

    1. Intel Corporation, Chandler, USA

    View editor publications

    You can also search for this editor in PubMed   Google Scholar

  • Provides comprehensive coverage of the state-of-the-art in 3D microelectronic packages
  • Covers advanced materials and processes, quality and reliability concerns, and fault isolation and failure analysis
  • Discusses 3D electronic package architecture and assembly process design
  • Features contributions from both academic and industry authors, for a complete view of this important technology
  • Includes supplementary material: sn.pub/extras

Part of the book series: Springer Series in Advanced Microelectronics (MICROELECTR., volume 57)

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Table of contents (15 chapters)

  1. Front Matter

    Pages i-ix
    Download chapter PDF

  2. Introduction to 3D Microelectronic Packaging

    • Yan Li, Deepak Goyal
    Pages 1-15

  3. 3D Packaging Architectures and Assembly Process Design

    • Ravi Mahajan, Bob Sankman
    Pages 17-46

  4. Materials and Processing of TSV

    • Praveen Kumar, Indranath Dutta, Zhiheng Huang, Paul Conway
    Pages 47-69

  5. Microstructural and Reliability Issues of TSV

    • Praveen Kumar, Indranath Dutta, Zhiheng Huang, Paul Conway
    Pages 71-99

  6. Fundamentals and Failures in Die Preparation for 3D Packaging

    • Hualiang Shi, Erasenthiran Poonjolai
    Pages 101-128

  7. Direct Cu to Cu Bonding and Other Alternative Bonding Techniques in 3D Packaging

    • Tadatomo Suga, Ran He, George Vakanas, Antonio La Manna
    Pages 129-155

  8. Fundamentals of Thermal Compression Bonding Technology and Process Materials for 2.5/3D Packages

    • Sangil Lee
    Pages 157-203

  9. Fundamentals of Solder Alloys in 3D Packaging

    • Kwang-Lung Lin
    Pages 205-222

  10. Fundamentals of Electromigration in Interconnects of 3D Packaging

    • Pilin Liu
    Pages 223-244

  11. Fundamentals of Heat Dissipation in 3D IC Packaging

    • Satish G. Kandlikar, Amlan Ganguly
    Pages 245-260

  12. Fundamentals of Advanced Materials and Processes in Organic Substrate Technology

    • Songhua Shi, Peter Tortorici
    Pages 261-291

  13. Die and Package Level Thermal and Thermal/Moisture Stresses in 3D Packaging: Modeling and Characterization

    • Liangbiao Chen, Tengfei Jiang, Xuejun Fan
    Pages 293-332

  14. Processing and Reliability of Solder Interconnections in Stacked Packaging

    • Paul Vianco
    Pages 333-373

  15. Interconnect Quality and Reliability of 3D Packaging

    • Yaodong Wang, Yingxia Liu, Menglu Li, K. N. Tu, Luhua Xu
    Pages 375-420

  16. Fault Isolation and Failure Analysis of 3D Packaging

    • Yan Li, Deepak Goyal
    Pages 421-459

  17. Back Matter

    Pages 461-463
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Keywords

About this book

This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development. 

Editors and Affiliations

  • Intel Corporation, Chandler, USA

    Yan Li, Deepak Goyal

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