Editors:
- Provides a single-source reference on carbon nanotubes for interconnect applications
- Includes complete coverage of current Cu-based interconnect problems for both 2D and 3D interconnects
- Covers topics from modeling, simulation, analysis, design and characterization, in order to provide a broad view of the application of carbon nanotubes for interconnects
- Includes supplementary material: sn.pub/extras
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Table of contents (11 chapters)
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Front Matter
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Process and Design
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Front Matter
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Applications
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Front Matter
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About this book
Reviews
Editors and Affiliations
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CNRS-LIRMM/University of Montpellier, Montpellier, France
Aida Todri-Sanial
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CEA LITEN, Grenoble, France
Jean Dijon
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University of Cassino and Southern Lazio, Cassino, Italy
Antonio Maffucci
About the editors
Bibliographic Information
Book Title: Carbon Nanotubes for Interconnects
Book Subtitle: Process, Design and Applications
Editors: Aida Todri-Sanial, Jean Dijon, Antonio Maffucci
DOI: https://doi.org/10.1007/978-3-319-29746-0
Publisher: Springer Cham
eBook Packages: Engineering, Engineering (R0)
Copyright Information: Springer International Publishing Switzerland 2017
Hardcover ISBN: 978-3-319-29744-6Published: 18 July 2016
Softcover ISBN: 978-3-319-80642-6Published: 30 May 2018
eBook ISBN: 978-3-319-29746-0Published: 09 July 2016
Edition Number: 1
Number of Pages: XII, 333
Number of Illustrations: 34 b/w illustrations, 133 illustrations in colour
Topics: Circuits and Systems, Processor Architectures, Electronic Circuits and Devices