Overview
- Provides single-source reference to the latest research in 3D optoelectronic integration: process, devices, and systems;
- Explains the use of wireless 3D integration to improve 3D IC reliability and yield;
- Describes techniques for monitoring and mitigating thermal behavior in 3D ICs;
- Includes discussion of 3D integration of high-density power sources and novel NVM.
- Includes supplementary material: sn.pub/extras
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Table of contents (17 chapters)
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Front Matter
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Electrical 3D Integration
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Front Matter
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Photonic and Opto-Electronic 3D Integration
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Front Matter
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Keywords
About this book
Reviews
“The book is valuable as a learning tool for 3D stacked chips through TSVs … . a valuable addition to a scientific library, as well as served as good introduction for device reliability engineers or specialists and industrials involved in the field of 3D stacking in wafer fabrication and integrated circuit design. … highly recommended for people who desire a better understanding of the theory and practice of 3D TSVs and technical considerations in 3D chips floorplanning, modeling and characterization.” (Chong Leong Gan and Uda Hashim, Microelectronics Reliability, Vol. 63, August, 2016)
Editors and Affiliations
About the editors
Ibrahim (Abe) M. Elfadel has 15 years of industrial experience in the research, development and deployment of advanced computer-aided design (CAD) tools and methodologies for deep-submicron, high-performance digital designs. Most recently, he played a key role in the development and deployment of IBM’s next-generation layout verification tools for the ultra-deep submicron CMOS technology nodes. Dr. Elfadel is the recipient of six Invention Achievement Awards, an Outstanding Technical Achievement Award and a Research Division Award, all from IBM, for his contributions in the area of VLSI CAD. He is currently serving as an Associate Editor for the IEEE Transactions on Computer-Aided Design for Integrated Circuits and Systems.
Gerhard Fettweis earned his Ph.D. under H. Meyr's supervision from RWTH Aachen in 1990. After one year at IBM Research in San Jose, CA he moved to TCSI Inc., Berkeley, CA. Since 1994 he is Vodafone Chair Professor at TU Dresden, Germany, with currently 20 companies from Asia/Europe/US sponsoring his research on wireless transmission and chip design. He coordinates 2 DFG centers at TU Dresden, cfAED and HAEC. Gerhard is IEEE Fellow, member of acatech, has an honorary doctorate from TU Tampere, and has received multiple awards. In Dresden he has spun-out ten start-ups, and setup funded projects of more than EUR 1/3 billion volume. He has helped organized IEEE conferences, most notably as TPC Chair of IEEE ICC 2009, IEEE TTM 2012, and Ge
neral Chair of VTC Spring 2013. He remains active within IEEE.Bibliographic Information
Book Title: 3D Stacked Chips
Book Subtitle: From Emerging Processes to Heterogeneous Systems
Editors: Ibrahim (Abe) M. Elfadel, Gerhard Fettweis
DOI: https://doi.org/10.1007/978-3-319-20481-9
Publisher: Springer Cham
eBook Packages: Engineering, Engineering (R0)
Copyright Information: Springer International Publishing Switzerland 2016
Hardcover ISBN: 978-3-319-20480-2Published: 23 May 2016
Softcover ISBN: 978-3-319-79305-4Published: 26 May 2018
eBook ISBN: 978-3-319-20481-9Published: 11 May 2016
Edition Number: 1
Number of Pages: XXIII, 339
Number of Illustrations: 81 b/w illustrations, 157 illustrations in colour
Topics: Circuits and Systems, Electronic Circuits and Devices, Processor Architectures