Overview
- A collection of 3D FPGA architecture exploration, physical design, implementation methodologies and CAD tools for Tree-based FPGA architecture
- Presents new and practical 3D FPGA interconnect topologies and architecture to improve the performance, area and logic density of modern FPGA designs
- Provides a foundation for building 3D reconfigurable devices which meets the requirements of today's prototyping and manufacturing industry
- Includes supplementary material: sn.pub/extras
Part of the book series: Lecture Notes in Electrical Engineering (LNEE, volume 350)
Access this book
Tax calculation will be finalised at checkout
Other ways to access
Table of contents (9 chapters)
-
Front Matter
-
Back Matter
Keywords
About this book
This book focuses on the development of 3D design and implementation methodologies for Tree-based FPGA architecture. It also stresses the needs for new and augmented 3D CAD tools to support designs such as, the design for 3D, to manufacture high performance 3D integrated circuits and reconfigurable FPGA-based systems. This book was written as a text that covers the foundations of 3D integrated system design and FPGA architecture design. It was written for the use in an elective or core course at the graduate level in field of Electrical Engineering, Computer Engineering and Doctoral Research programs. No previous background on 3D integration is required, nevertheless fundamental understanding of 2D CMOS VLSI design is required. It is assumed that reader has taken the core curriculum in Electrical Engineering or Computer Engineering, with courses like CMOS VLSI design, Digital System Design and Microelectronics Circuits being the most important. It is accessible for self-study by both senior students and professionals alike.
Authors and Affiliations
Bibliographic Information
Book Title: Three-Dimensional Design Methodologies for Tree-based FPGA Architecture
Authors: Vinod Pangracious, Zied Marrakchi, Habib Mehrez
Series Title: Lecture Notes in Electrical Engineering
DOI: https://doi.org/10.1007/978-3-319-19174-4
Publisher: Springer Cham
eBook Packages: Engineering, Engineering (R0)
Copyright Information: Springer International Publishing Switzerland 2015
Hardcover ISBN: 978-3-319-19173-7Published: 08 July 2015
Softcover ISBN: 978-3-319-38687-4Published: 19 October 2016
eBook ISBN: 978-3-319-19174-4Published: 25 June 2015
Series ISSN: 1876-1100
Series E-ISSN: 1876-1119
Edition Number: 1
Number of Pages: XXI, 226
Number of Illustrations: 11 b/w illustrations, 102 illustrations in colour
Topics: Circuits and Systems, Electronics and Microelectronics, Instrumentation, Processor Architectures