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Thermal Contact Conductance

  • Book
  • © 2014

Overview

Authors:
  1. Chakravarti V. Madhusudana

    1. Sydney, Australia

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  • Includes numerous new heat transfer applications
  • Describes a generalised approach for determining solid spot conductance
  • Expanded transient measurements including the laser flash method
  • Includes supplementary material: sn.pub/extras

Part of the book series: Mechanical Engineering Series (MES)

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Table of contents (11 chapters)

  1. Front Matter

    Pages i-xviii
    Download chapter PDF

  2. Introduction

    • C. V. Madhusudana
    Pages 1-8

  3. Thermal Constriction Resistance

    • C. V. Madhusudana
    Pages 9-23

  4. Solid Spot Thermal Conductance of a Joint

    • C. V. Madhusudana
    Pages 25-54

  5. Gap Conductance at the Interface

    • C. V. Madhusudana
    Pages 55-77

  6. Experimental Aspects

    • C. V. Madhusudana
    Pages 79-96

  7. Special Configurations and Processes

    • C. V. Madhusudana
    Pages 97-137

  8. Control of Thermal Contact Conductance Using Interstitial Materials and Coatings

    • C. V. Madhusudana
    Pages 139-179

  9. Major Applications

    • C. V. Madhusudana
    Pages 181-215

  10. Additional Topics

    • C. V. Madhusudana
    Pages 217-243

  11. Concluding Remarks

    • C. V. Madhusudana
    Pages 245-250

  12. Erratum to: Control of Thermal Contact Conductance Using Interstitial Materials and Coatings

    • C. V. Madhusudana
    Pages E1-E2

  13. Back Matter

    Pages 251-260
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Keywords

About this book

The work covers both theoretical and practical aspects of thermal contact conductance. The theoretical discussion focuses on heat transfer through spots, joints, and surfaces, as well as the role of interstitial materials (both planned and inadvertent). The practical discussion includes formulae and data that can be used in designing heat-transfer equipment for a variety of joints, including special geometries and configurations. All of the material has been updated to reflect the latest advances in the field.

Reviews

Reviewer 1:

The composition of the book follows a classic outline. It includes comprehensive theoretical insight into the phenomenon of TCC which establishes the links between the main physical characteristics determining TCC (properties of materials, surfaces and interstitial media), in the form of non-dimensional correlations. This allows the author to present TCC for variety of different materials in a simple form. It provides a summary of the experimental methods, collates and classifies information on the performance of different joints, hereby giving a useful update on the status of the field over half a century. Thus, the book is a good source of basic academic knowledge on TCC.

 

Reviewer 2:

This book would most certainly serve as a reference book; libraries of universities from all over the world should certainly buy it. Students can use it to learn the basic analytical methods and the experimental set-ups used.

 

Reviewer 3:

The whole style of this book, including illustrations is used very well.  The examples are very vivid.  It is easy to understand for machinery and materials processing engineering undergraduate students and masters.

Authors and Affiliations

  • Sydney, Australia

    Chakravarti V. Madhusudana

About the author

Professor Madhusudana is currently working out of Sudney, Australia

Bibliographic Information

  • Book Title: Thermal Contact Conductance

  • Authors: Chakravarti V. Madhusudana

  • Series Title: Mechanical Engineering Series

  • DOI: https://doi.org/10.1007/978-3-319-01276-6

  • Publisher: Springer Cham

  • eBook Packages: Engineering, Engineering (R0)

  • Copyright Information: Springer International Publishing Switzerland 2014

  • Hardcover ISBN: 978-3-319-01275-9Published: 07 October 2013

  • Softcover ISBN: 978-3-319-37428-4Published: 23 August 2016

  • eBook ISBN: 978-3-319-01276-6Published: 24 September 2013

  • Series ISSN: 0941-5122

  • Series E-ISSN: 2192-063X

  • Edition Number: 2

  • Number of Pages: XVIII, 260

  • Number of Illustrations: 116 b/w illustrations, 17 illustrations in colour

  • Topics: Engineering Thermodynamics, Heat and Mass Transfer

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