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The Boundary-Scan Handbook

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  • © 2016
  • Latest edition

Overview

  • Provides an overview of the recent changes to the 1149.1 standard and the effect of the changes on the work of test engineers
  • Explains the new IEEE 1149.8.1 subsidiary standard and applications
  • Describes the latest updates on the supplementary IEEE testing standards

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Table of contents (12 chapters)

  1. Classical Boundary-Scan

  2. Boundary-Scan Updated

Keywords

About this book

Aimed at electronics industry professionals, this 4th edition of the Boundary Scan Handbook describes recent changes to the IEEE1149.1 Standard Test Access Port and Boundary-Scan Architecture. This updated edition features new chapters on the possible effects of the changes on the work of the practicing test engineers and the new 1149.8.1 standard. Anyone needing to understand the basics of boundary scan and its practical industrial implementation will need this book.


Provides an overview of the recent changes to the 1149.1 standard and the effect of the changes on the work of test engineers;
 
Explains the new IEEE 1149.8.1 subsidiary standard and applications;
 
Describes the latest updates on the supplementary IEEE testing standards.


In particular, addresses:


IEEE Std 1149.1                  Digital Boundary-Scan
IEEE Std 1149.4                  Analog Boundary-Scan
IEEE Std 1149.6                  Advanced I/O Testing
IEEE Std 1149.8.1                Passive Component Testing
IEEE Std 1149.1-2013             The 2013 Revision of 114
9.1
IEEE Std 1532                    In-System ConfigurationIEEE Std 1149.6-2015             The 2015 Revision of 1149.6


Authors and Affiliations

  • Fort Collins, USA

    Kenneth P. Parker

About the author

Dr. Kenneth P. Parker received his PHD at Stanford University. He has recently retired from a career with Hewlett-Packard and Agilent Technologies in the field of testing of electrical assemblies.

Bibliographic Information

  • Book Title: The Boundary-Scan Handbook

  • Authors: Kenneth P. Parker

  • DOI: https://doi.org/10.1007/978-3-319-01174-5

  • Publisher: Springer Cham

  • eBook Packages: Engineering, Engineering (R0)

  • Copyright Information: Springer International Publishing Switzerland 2016

  • Hardcover ISBN: 978-3-319-01173-8Published: 23 November 2015

  • Softcover ISBN: 978-3-319-33069-3Published: 23 August 2016

  • eBook ISBN: 978-3-319-01174-5Published: 11 November 2015

  • Edition Number: 4

  • Number of Pages: XXXIV, 552

  • Topics: Circuits and Systems, Processor Architectures, Semiconductors

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