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Advances in Electronic Circuit Packaging

Volume 2 Proceedings of the Second International Electronic Circuit Packaging Symposium, sponsored by the University of Colorado and EDN (Electrical Design News), held at Boulder, Colorado

  • Conference proceedings
  • © 1962

Overview

Editors:
  1. Gerald A. Walker

    1. Electrical Design News, USA

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Table of contents (24 papers)

  1. Front Matter

    Pages i-xv
    Download chapter PDF

  2. Materials for Electronic Packaging

    • D. A. Beck
    Pages 1-20

  3. Controlling the Mechanical Response of Printed Circuit Boards

    • R. P. Thorn
    Pages 21-34

  4. A Low-Density Potting Compound

    • A. J. Quant
    Pages 35-51

  5. An Effective Use of Castings in a Lightweight Electronic Package

    • Harold Ferris, John B. Willbanks
    Pages 52-60

  6. Heat Sinks and Encapsulants for Volumetric Packaging

    • Lawrence V. Gallacher
    Pages 61-76

  7. Potting Problems Related to Packaging Design

    • Benjamin A. Davis
    Pages 77-90

  8. Packaging of Semiconductor Networks

    • Ernest C. Singletary
    Pages 91-103

  9. Thermal Packaging for Transient Operation

    • Jacob G. Bartas
    Pages 104-120

  10. Formulation and Solution of Circuit Card Design Problems through Use of Graph Methods

    • Uno R. Kodres
    Pages 121-142

  11. Maintainable Electronic Component Assemblies

    • Harry Wasiele Jr.
    Pages 143-165

  12. Electronic Packaging for 5000 g Survival

    • Wayne F. Miller
    Pages 166-180

  13. Packaging of a Telemeter to Withstand Impulse Accelerations of 500,000 g

    • Raymond Young
    Pages 181-202

  14. The Welded-Wire Matrix—An Important Step Beyond Printed Wiring

    • Thomas Telfer
    Pages 203-212

  15. Weld Improvement Study Indicating Future Electronics Packaging Applications

    • R. M. Steigerwald
    Pages 213-218

  16. Automatic Packaging of Miniaturized Circuits

    • R. L. Gamblin, M. Q. Jacobs, C. J. Tunis
    Pages 219-232

  17. Illogical Packaging Design

    • Edward F. Uber, Kenneth L. Jones
    Pages 233-238

  18. Radiation-Effects Considerations in the Design of Electronic Circuit Packaging for Nuclear-Powered Vehicles

    • J. H. Levine
    Pages 239-253

  19. Electronic Packaging for Oil-Well Logging

    • Lyman M. Edwards
    Pages 254-263

  20. Instrumentation Equipment for Polaris Firing Submarines Installed in a Unique Modular Design

    • Aubrey H. Jones
    Pages 264-278
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Keywords

Editors and Affiliations

  • Electrical Design News, USA

    Gerald A. Walker

Bibliographic Information

  • Book Title: Advances in Electronic Circuit Packaging

  • Book Subtitle: Volume 2 Proceedings of the Second International Electronic Circuit Packaging Symposium, sponsored by the University of Colorado and EDN (Electrical Design News), held at Boulder, Colorado

  • Editors: Gerald A. Walker

  • DOI: https://doi.org/10.1007/978-1-4899-7311-5

  • Publisher: Springer New York, NY

  • eBook Packages: Springer Book Archive

  • Copyright Information: Springer Science+Business Media New York 1962

  • Softcover ISBN: 978-1-4899-7297-2Published: 01 January 1962

  • eBook ISBN: 978-1-4899-7311-5Published: 11 December 2013

  • Edition Number: 1

  • Number of Pages: XV, 328

  • Number of Illustrations: 176 b/w illustrations

  • Topics: Electronic Circuits and Devices, Electronics and Microelectronics, Instrumentation

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