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Advances in Electronic Circuit Packaging

Volume 5 Proceedings of the Fifth International Electronic Circuit Packaging Symposium sponsored by the University of Colorado, EDN (Electrical Design News), and Design News, held at Boulder, Colorado, August 19–21, 1964

  • Conference proceedings
  • © 1965

Overview

Editors:
  1. Lawrence L. Rosine
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Table of contents (26 papers)

  1. Front Matter

    Pages i-vi
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  2. Encapsulants for Electronic Packaging

    • George R. Dallimore
    Pages 1-12

  3. Use of Radiation-Cross-Linked Materials for Encapsulating and Terminating Devices

    • Paul Sherlock
    Pages 13-20

  4. Encapsulating with Loose Microballoons

    • E. C. Neidel
    Pages 21-27

  5. Packaging Concept for a Miniature Low-Light-Level TV Camera

    • Edmund C. Decker
    Pages 28-42

  6. The Heat-Sink Module

    • R. E. Klein, J. Gammon
    Pages 43-57

  7. Producibility Norms for Electronic System Packaging

    • E. I. Moore, L. M. Schneider
    Pages 58-62

  8. Development of Packaging Techniques for a 960-Bit Plated-Wire Memory

    • Gilbert R. Reid
    Pages 63-71

  9. Packaging Computer Circuitry for Space Applications—A Two-Part Compendium

    • Donald Shaner, Frank L. Jennings
    Pages 72-86

  10. A Cost and Performance Analysis of Encapsulation by Transfer Molding

    • Robert F. Zecher
    Pages 87-97

  11. Packaging of Miniature Diode Assemblies

    • H. B. Bell, G. A. Doyle
    Pages 98-105

  12. Transfer Molding of Silicone Compounds for Environmental Protection of Electronic Modular Systems

    • Frederic J. Lockhart
    Pages 106-118

  13. A Feasibility Study in Miniaturized Packaging

    • T. J. Williams, R. R. Rogers
    Pages 119-132

  14. Interconnection and Organization of Functional Electronic Blocks

    • Robert C. MacIntyre, Herbert Winsker
    Pages 133-140

  15. Designing for Multilayer Circuits

    • Lawrence D. Hunter, Robert W. Korb
    Pages 141-156

  16. A Flexible Module Concept for Electronic Box Design

    • Frederick L. Koved
    Pages 157-164

  17. A High-Frequency Multiple-Signal-Conductor Transmission Line

    • R. C. Paulsen, W. K. Springfield
    Pages 165-177

  18. High-Frequency Interconnections

    • William L. Thibodeau
    Pages 178-187

  19. Interconnection System

    • Steve Zelencik
    Pages 188-200

  20. Substitution of a Printed Conductor Ring Harness for a Conventional Cable Harness on the Mariner Series Spacecraft

    • Earle R. Bunker Jr.
    Pages 201-213
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Keywords

Bibliographic Information

  • Book Title: Advances in Electronic Circuit Packaging

  • Book Subtitle: Volume 5 Proceedings of the Fifth International Electronic Circuit Packaging Symposium sponsored by the University of Colorado, EDN (Electrical Design News), and Design News, held at Boulder, Colorado, August 19–21, 1964

  • Editors: Lawrence L. Rosine

  • DOI: https://doi.org/10.1007/978-1-4899-7307-8

  • Publisher: Springer New York, NY

  • eBook Packages: Springer Book Archive

  • Copyright Information: Springer Science+Business Media New York 1965

  • Softcover ISBN: 978-1-4899-7295-8Published: 01 January 1965

  • eBook ISBN: 978-1-4899-7307-8Published: 01 December 2013

  • Edition Number: 1

  • Number of Pages: VI, 297

  • Number of Illustrations: 267 b/w illustrations

  • Topics: Electronic Circuits and Devices, Electronics and Microelectronics, Instrumentation

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