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Advances in Electronic Circuit Packaging

Volume 3

  • Book
  • © 1963

Overview

Editors:
  1. Lawrence L. Rosine
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Table of contents (29 chapters)

  1. Front Matter

    Pages i-vi
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  2. Keynote Address

    • Ralph Leigh Clark
    Pages 1-8

  3. Economic Aspects of Display Panel Packaging

    • Robert O. Link
    Pages 9-20

  4. Designing and Packaging Electronic Modular Enclosures That Never Leave the Ground

    • Vincent J. Galati
    Pages 21-41

  5. Flexibility in Control/Display Panel Packaging

    • Frank M. Joyner Jr.
    Pages 42-54

  6. Packaging the Lenkurt 76A Microwave Radio

    • Stu Aleshire
    Pages 55-71

  7. Packaging for Maintainability of an Airborne Computer: A Case History

    • Louis R. Critelli
    Pages 72-84

  8. Digital Micromodular Equipment (MICROPAC) Design Concepts

    • A. H. Coleman, H. K. Sauer
    Pages 85-114

  9. Selection of Packaging Materials for Oceanographic Instruments

    • Richard Moeller
    Pages 115-133

  10. A Unique Approach to Welded Packaging

    • R. D. Ciccone, E. J. Lorenz
    Pages 134-152

  11. INTERCON—Prefabricated Weldable Circuitry

    • Bruce R. McFadden
    Pages 153-167

  12. How Altitude Affects Forced Air Cooling Requirements of Electronic Equipment

    • Gregory G. Gebert
    Pages 168-181

  13. Space Seal Study

    • Art Shafran
    Pages 182-193

  14. An Analysis of Forced Convection Heat Transfer in High-Density Circuit Packages

    • John H. King Jr.
    Pages 194-212

  15. Transient Thermal Analysis of the Weld-Pak Package

    • Donald L. Cochran
    Pages 213-230

  16. Packaging of Electronic Systems Utilizing Commercially Available Integrated Circuits

    • Frederick Bassett
    Pages 231-243

  17. A Packaging Method for Thin-Film Microelectronic Systems

    • Clifford K. Lodder, John E. Vineski
    Pages 244-263

  18. Microcircuitry: An Approach to the Fabrication of Microelectronic Circuitry

    • Franklin L. Feigin
    Pages 264-276

  19. Microelectronics and Megaheadaches

    • Kenneth L. Jones, Edward F. Uber
    Pages 277-294

  20. Microelectronic Connections

    • J. R. Goodykoontz, F. T. Brewen, B. D. Brock, J. C. Heindl
    Pages 295-319
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Keywords

Bibliographic Information

  • Book Title: Advances in Electronic Circuit Packaging

  • Book Subtitle: Volume 3

  • Editors: Lawrence L. Rosine

  • DOI: https://doi.org/10.1007/978-1-4899-7309-2

  • Publisher: Springer New York, NY

  • eBook Packages: Springer Book Archive

  • Copyright Information: Springer Science+Business Media New York 1963

  • Softcover ISBN: 978-1-4899-7296-5Published: 01 January 1963

  • eBook ISBN: 978-1-4899-7309-2Published: 11 December 2013

  • Edition Number: 1

  • Number of Pages: VI, 457

  • Number of Illustrations: 341 b/w illustrations

  • Topics: Electronic Circuits and Devices, Electronics and Microelectronics, Instrumentation

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