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  • Conference proceedings
  • © 1965

Advances in Electronic Circuit Packaging

Volume 5 Proceedings of the Fifth International Electronic Circuit Packaging Symposium sponsored by the University of Colorado, EDN (Electrical Design News), and Design News, held at Boulder, Colorado, August 19–21, 1964

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Table of contents (26 papers)

  1. Front Matter

    Pages i-vi
  2. Encapsulants for Electronic Packaging

    • George R. Dallimore
    Pages 1-12
  3. Encapsulating with Loose Microballoons

    • E. C. Neidel
    Pages 21-27
  4. The Heat-Sink Module

    • R. E. Klein, J. Gammon
    Pages 43-57
  5. Producibility Norms for Electronic System Packaging

    • E. I. Moore, L. M. Schneider
    Pages 58-62
  6. Packaging of Miniature Diode Assemblies

    • H. B. Bell, G. A. Doyle
    Pages 98-105
  7. A Feasibility Study in Miniaturized Packaging

    • T. J. Williams, R. R. Rogers
    Pages 119-132
  8. Interconnection and Organization of Functional Electronic Blocks

    • Robert C. MacIntyre, Herbert Winsker
    Pages 133-140
  9. Designing for Multilayer Circuits

    • Lawrence D. Hunter, Robert W. Korb
    Pages 141-156
  10. A Flexible Module Concept for Electronic Box Design

    • Frederick L. Koved
    Pages 157-164
  11. A High-Frequency Multiple-Signal-Conductor Transmission Line

    • R. C. Paulsen, W. K. Springfield
    Pages 165-177
  12. High-Frequency Interconnections

    • William L. Thibodeau
    Pages 178-187
  13. Interconnection System

    • Steve Zelencik
    Pages 188-200

Bibliographic Information

  • Book Title: Advances in Electronic Circuit Packaging

  • Book Subtitle: Volume 5 Proceedings of the Fifth International Electronic Circuit Packaging Symposium sponsored by the University of Colorado, EDN (Electrical Design News), and Design News, held at Boulder, Colorado, August 19–21, 1964

  • Editors: Lawrence L. Rosine

  • DOI: https://doi.org/10.1007/978-1-4899-7307-8

  • Publisher: Springer New York, NY

  • eBook Packages: Springer Book Archive

  • Copyright Information: Springer Science+Business Media New York 1965

  • Softcover ISBN: 978-1-4899-7295-8Published: 01 January 1965

  • eBook ISBN: 978-1-4899-7307-8Published: 01 December 2013

  • Edition Number: 1

  • Number of Pages: VI, 297

  • Number of Illustrations: 267 b/w illustrations

  • Topics: Electronic Circuits and Devices, Electronics and Microelectronics, Instrumentation

Buy it now

Buying options

eBook USD 39.99
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book USD 54.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Other ways to access