Metallized Plastics 2

1. Front Matter

   Pages i-ix

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2. Metallization Techniques and Properties of Metal Deposits

   1. Front Matter

      Pages 1-1

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   2. An Electrochemical Method of Polyimide Metallization

      • Larry J. Krause, Tom A. Speckhard

      Pages 3-14

   3. Electroplating of Polymers, Gas Permeability and Adhesion of the Composite Materials

      • Jürgen Springer, Gisela Schammler

      Pages 15-34

   4. Molecular Level Metal and Ceramic/Polymer Composites: Synthesis of Metal and Metal Oxide Containing Polyimides and its Relevance to Polymer Metallization

      • Ayusman Sen, Manish Nandi, Jeanine A. Conklin

      Pages 35-55

   5. Photolithographic Plating of Platinum and Copper on Insulating Substrates

      • Meisheng Zhou, Randy E. Cameron, Frank J. Schwab, Andrew B. Bocarsly

      Pages 57-71

   6. Metallized Indium Island Films for Flexible Automotive Trim

      • Richard Eisfeller, John S. Judge

      Pages 73-80

   7. Metallization of Plastics by Physical Vapor Deposition Techniques

      • C. T. Wan, K. A. Taylor, D. L. Chambers, G. T. Susi

      Pages 81-95

   8. Ion Beam Assisted Metallization of Plastics

      • Th. Flottmann, W. Lohmann

      Pages 97-111

   9. Plasma Induced Deposition of Copper Films on Polymer Surfaces

      • R. Padiyath, M. David, S. V. Babu

      Pages 113-120

   10. Metallization of Polytetrafluoroethylene (PTFE) by Means of Plasma-Enhanced Chemical Vapour Deposition

       • H. Meyer, R. Schulz, H. Suhr, C. Haag, K. Horn, A. M. Bradshaw

       Pages 121-130

   11. Metallization of Plastics Via Low Temperature Arc Vapor Deposition (LTAVD)

       • K. R. Narendrnath, D. Mager

       Pages 131-140

   12. Magnetron Sputtered Tin Hard Coatings on Plastics

       • O. Knotek, F. Löffler

       Pages 141-148

   13. Diffusion and Gettering Simulations of Ion Implanted Copper in Polyimide

       • J. H. Das, J. E. Morris

       Pages 149-161

3. Investigation of Interfacial Interactions

   1. Front Matter

      Pages 163-163

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   2. Comparison Between the Interfacial Chemistry of Metallized Polyimides and Polyimide Films on Bulk Metal Substrates

      • M. Grunze, A. Killinger, C. Thümmler, C. Hahn, T. Strunskus

      Pages 165-177

   3. Chemical Interactions at Polymer-Metal Interfaces of Interest to Microelectronics

      • S. Pignataro

      Pages 179-188

   4. Photoelectron Spectroscopy Model Study of the Interface Between Polyimide and Copper

      • P. Bodö, K. Uvdal, W. R. Salaneck

      Pages 189-198

   5. Electronic Structure of Metal/Polymer Interfaces: Aluminum on Conjugated Polymers

      • R. Lazzaroni, J. L. Brédas, M. Chtaïb, P. Snauwaert, P. Dannetun, M. Lögdlund et al.

      Pages 199-212

   6. Study of Chemical Interactions in Metallized Polymers Used for Microelectronic Packaging

      • Hyo-Soo Jeong, Robert C. White

      Pages 213-218

This volume documents the proceedings of the Second Symposium on Metallized Plastics: Fundamental and Applied Aspects held under the aegis of the Dielectric Science and Technology Division of the Electrochemical Society in Montreal, Canada, May 7-10, 1990. The first symposium on this topic was held in Chicago, October 10-12, 1988 and the proceedings of l which have been chronicled in a hard-bound volume l As pointed out in the Preface to the proceedings of the first symposium the metallized plastics find scores of applications ranging from very mundane to very sophisticated. Even a cursory look at the literature will convince that this field has sprouted; and there is every reason to believe that with all the research and development activities taking place, new and exciting applications of metallized plastics will emerge. The program for the second symposium was very comprehensive as it included 46 papers covering many aspects of metallized plastics. This symposium was a testimonial to the brisk research activity and keen interest in the topic of metallized plastics. The success of this symposium reinforced our earlier belief that there was a definite need to hold symposia on this topic on a regular basis. Concomitantly, the third symposium in this vein was held in Phoenix, Arizona, October 13-18, 1991 and the fourth is planned for May 16-21, 1993 in Honolulu, Hawaii. As regards the present volume, it contains a total of 35 papers covering a variety of topics ranging from very fundamental to very applied.

• ITIES
• Ion
• Polyimide
• copper
• metals
• plastics
• platinum
• polymer
• polymers
• structure

• IBM U.S. Technical Education, Thornwood, USA

  Kashmiri Lal Mittal

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