Skip to main content

Nondestructive Evaluation of Semiconductor Materials and Devices

  • Book
  • © 1979

Overview

Part of the book series: NATO Science Series B: (NSSB, volume 46)

This is a preview of subscription content, log in via an institution to check access.

Access this book

eBook USD 39.99
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book USD 54.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Other ways to access

Licence this eBook for your library

Institutional subscriptions

Table of contents (14 chapters)

Keywords

About this book

From September 19-29, a NATO Advanced Study Institute on Non­ destructive Evaluation of Semiconductor Materials and Devices was held at the Villa Tuscolano in Frascati, Italy. A total of 80 attendees and lecturers participated in the program which covered many of the important topics in this field. The subject matter was divided to emphasize the following different types of problems: electrical measurements; acoustic measurements; scanning techniques; optical methods; backscatter methods; x-ray observations; accele­ rated life tests. It would be difficult to give a full discussion of such an Institute without going through the major points of each speaker. Clearly this is the proper task of the eventual readers of these Proceedings. Instead, it would be preferable to stress some general issues. What came through very clearly is that the measurements of the basic scientists in materials and device phenomena are of sub­ stantial immediate concern to the device technologies and end users.

Editors and Affiliations

  • The University of Pennsylvania, Philadelphia, USA

    Jay N. Zemel

Bibliographic Information

  • Book Title: Nondestructive Evaluation of Semiconductor Materials and Devices

  • Editors: Jay N. Zemel

  • Series Title: NATO Science Series B:

  • DOI: https://doi.org/10.1007/978-1-4757-1352-7

  • Publisher: Springer New York, NY

  • eBook Packages: Springer Book Archive

  • Copyright Information: Springer Science+Business Media New York 1979

  • Softcover ISBN: 978-1-4757-1354-1Published: 11 September 2013

  • eBook ISBN: 978-1-4757-1352-7Published: 11 November 2013

  • Series ISSN: 0258-1221

  • Edition Number: 1

  • Number of Pages: XI, 782

  • Topics: Electrical Engineering

Publish with us