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Thermal Stress and Strain in Microelectronics Packaging

  • Book
  • © 1993

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Editors:
  1. John H. Lau

    1. Hewlett-Packard Company, Palo Alto, USA

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Table of contents (23 chapters)

  1. Front Matter

    Pages i-xxiii
    Download chapter PDF

  2. Thermomechanics for Electronics Packaging

    • John H. Lau
    Pages 1-77

  3. Thermal Expansivity and Thermal Stress in Multilayered Structures

    • Peter M. Hall
    Pages 78-94

  4. Thermal Stresses in Anisotropic Multilayered Structures

    • Wan-Lee Yin
    Pages 95-138

  5. Transient Thermal Stresses in Multilayered Devices

    • An-Yu Kuo, Kuan-Luen Chen
    Pages 139-172

  6. Temperature Dependence of Thermal Expansion of Materials for Electronics Packages

    • R. Chanchani, Peter M. Hall
    Pages 173-193

  7. Thermal Stress Considerations in Die-Attachment

    • Goran S. Matijasevic, Chen Yu Wang, Chin C. Lee
    Pages 194-220

  8. Die Stress Measurement Using Piezoresistive Stress Sensors

    • James N. Sweet
    Pages 221-271

  9. Analysis of the Thermal Loading on Electronics Packages by Enhanced Moiré Interferometry

    • Arkady Voloshin
    Pages 272-304

  10. Correlation of Analytical and Experimental Approaches to Determination of Thermally Induced Printed Wiring Board (PWB) Warpage

    • C.-P. Yeh, C. Ume, R. E. Fulton, K. W. Wyatt, J. W. Stafford
    Pages 305-328

  11. Thermal Stress-Induced Open-Circuit Failure in Microelectronics Thin-Film Metallizations

    • Q. Guo, L. M. Keer, Y.-W. Chung
    Pages 329-359

  12. Thermal Stress and Stress-Induced Voiding in Passivated Narrow Line Metallizations on Ceramic Substrates

    • M. A. Korhonen, P. Børgesen, Che-Yu Li
    Pages 360-384

  13. Predicted Bow of Plastic Packages of Integrated Circuit (IC) Devices

    • E. Suhir
    Pages 385-409

  14. Thermal and Moisture Stresses in Plastic Packages

    • Michel Mermet-Guyennet
    Pages 410-444

  15. Solutions to Moisture Resistance Degradation During Solder Reflow of Plastic Surface Mount Components

    • Suresh V. Golwalkar
    Pages 445-466

  16. Thermomechanical Fatigue of 63Sn-37Pb Solder Joints

    • Peter L. Hacke, Arnold F. Sprecher, Hans Conrad
    Pages 467-499

  17. A Prediction of the Thermal Fatigue Life of Solder Joints Using Crack Propagation Rate and Equivalent Strain Range

    • Ryohei Satoh
    Pages 500-531

  18. Microstructural Evaluation of Sn-Pb Solder and Pd-Ag Thick-Film Conductor Metallization Under Thermal Cycling and Aging Conditions

    • Jenq-Gong Duh, Kuo-Chuan Liu, Bi-Shiou Chiou
    Pages 532-578

  19. Solder Joint Reliability of Leadless Chip Carriers

    • Jim Lynch, Alberto Boetti
    Pages 579-606

  20. Solder Creep-Fatigue Interactions with Flexible Leaded Surface Mount Components

    • R. G. Ross Jr., L.-C. Wen
    Pages 607-647
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Keywords

About this book

Microelectronics packaging and interconnection have experienced exciting growth stimulated by the recognition that systems, not just silicon, provide the solution to evolving applications. In order to have a high density/ performance/yield/quality/reliability, low cost, and light weight system, a more precise understanding of the system behavior is required. Mechanical and thermal phenomena are among the least understood and most complex of the many phenomena encountered in microelectronics packaging systems and are found on the critical path of neatly every design and process in the electronics industry. The last decade has witnessed an explosive growth in the research and development efforts devoted to determining the mechanical and thermal behaviors of microelectronics packaging. With the advance of very large scale integration technologies, thousands to tens of thousands of devices can be fabricated on a silicon chip. At the same time, demands to further reduce packaging signal delay and increase packaging density between communicat­ ing circuits have led to the use of very high power dissipation single-chip modules and multi-chip modules. The result of these developments has been a rapid growth in module level heat flux within the personal, workstation, midrange, mainframe, and super computers. Thus, thermal (temperature, stress, and strain) management is vital for microelectronics packaging designs and analyses. How to determine the temperature distribution in the elec­ tronics components and systems is outside the scope of this book, which focuses on the determination of stress and strain distributions in the electronics packaging.

Editors and Affiliations

  • Hewlett-Packard Company, Palo Alto, USA

    John H. Lau

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