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  • © 1983

Thermal Conductivity 16

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Table of contents (51 chapters)

  1. Front Matter

    Pages i-xx
  2. Theory, Solids at Low Temperature — I

    1. Front Matter

      Pages 1-1
    2. The Phonon-Dislocation Interaction

      • A. C. Anderson
      Pages 3-6
    3. Phonon Scattering by Point Defects in Copper Alloys

      • N. Sadanand, D. H. Damon
      Pages 21-29
    4. Effect of Tin and Tellurium on the Lattice Thermal Conductivity of Bismuth

      • J. Boxus, J. P. Issi, J. P. Michenaud, J. Heremans
      Pages 47-57
  3. Geologic Materials — I

    1. Front Matter

      Pages 59-59
    2. Thermal Conductivity Systems for Measurements on Rocks under Applied Stress

      • T. Ashworth, R. A. Murdock, E. Ashworth
      Pages 91-99
    3. Effective Thermal Conductivity of Granular Materials in Cylindrical Beds

      • M. S. Khader, R. I. Vachon, J. S. Goodling
      Pages 101-112
    4. Thermal Properties of Moist Granular Materials at Temperatures Below 0°C

      • I. A. van Haneghem, H. P. A. Boshoven
      Pages 113-129
  4. Theory, Solids at Low Temperature — II

    1. Front Matter

      Pages 131-131
    2. Thermal Conductivity of Damaged MgO

      • C. L. Tsai, A. R. Moodenbaugh, H. Weinstock, Y. Chen
      Pages 139-154
    3. Ideal Thermal Conductivity of Pd and Nb

      • F. J. Pinski, W. H. Butler, P. B. Allen
      Pages 155-163
  5. Geologic Materials — II

    1. Front Matter

      Pages 179-179

About this book

The International Thermal Conductivity Conference was started in 1961 with the initiative of Mr. C. F. Lucks and grew out of the needs of researchers in the field. From 1961 to 1973 the Confer­ ences were held annually, and have been held biennially since 1975 when our Center for Information and Numerical Data Analysis and Synthesis (CINDAS) of Purdue University became the permanent Spon­ sor of the Conferences. These Conferences provide a broadly based forum for researchers actively working on the thermal conductivity and closely related properties to convene on a regular basis to ex­ change their ideas and experiences and report their findings and results. The Conferences have been self-perpetuating and are an example of how a technical community with a common purpose can transcend the invisible, artificial barriers between disciplines and gather togeth­ er in increasing numbers without the need of national publicity and continuing funding support, when they see something worthwi1e going on. It is believed that this series of Conferences not only will grow stronger, but will set an example for researchers in other fields on how to jointly attack their own problem areas.

Editors and Affiliations

  • IIT Research Institute, Chicago, USA

    David C. Larsen

Bibliographic Information

  • Book Title: Thermal Conductivity 16

  • Editors: David C. Larsen

  • DOI: https://doi.org/10.1007/978-1-4684-4265-6

  • Publisher: Springer New York, NY

  • eBook Packages: Springer Book Archive

  • Copyright Information: Purdue Research Foundation 1983

  • Softcover ISBN: 978-1-4684-4267-0Published: 03 April 2012

  • eBook ISBN: 978-1-4684-4265-6Published: 06 December 2012

  • Edition Number: 1

  • Number of Pages: XX, 624

  • Topics: Characterization and Evaluation of Materials

Buy it now

Buying options

eBook USD 84.99
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book USD 109.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Other ways to access