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The Mechanics of Solder Alloy Wetting and Spreading

  • Book
  • © 1993

Overview

Editors:
  1. F. G. Yost

    1. Sandia National Laboratories, Department 1831, Center for Solder Science & Technology, Albuquerque, USA

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  2. F. M. Hosking

    1. Sandia National Laboratories, Department 1831, Center for Solder Science & Technology, Albuquerque, USA

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  3. D. R. Frear

    1. Sandia National Laboratories, Department 1832, Center for Solder Science & Technology, Albuquerque, USA

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Table of contents (10 chapters)

  1. Front Matter

    Pages i-xix
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  2. Introduction: The Mechanics of Solder Alloy Wetting and Spreading

    • F. G. Yost, F. M. Hosking, D. R. Frear
    Pages 1-7

  3. Solderability Testing

    • Bill Hampshire, Mike Wolverton
    Pages 9-33

  4. Fluxes and Flux Action

    • Colin A. MacKay
    Pages 35-101

  5. Reactive Wetting and Intermetallic Formation

    • William J. Boettinger, Carol A. Handwerker, Ursula R. Kattner
    Pages 103-140

  6. Loss of Solderability and Dewetting

    • Krishna Rajan
    Pages 141-153

  7. Oxidation of Solder Coatings

    • D. Morgan Tench
    Pages 155-189

  8. Surface and Interface Energy Measurements

    • R. Trivedi, J. D. Hunt
    Pages 191-226

  9. Advanced Soldering Processes

    • J. L. Jellison, J. Golden, D. R. Frear, F. M. Hosking, D. M. Keicher, F. G. Yost
    Pages 227-266

  10. Reliability-Related Solder Joint Inspection

    • Don Lewis Millard
    Pages 267-297

  11. The Properties of Composite Solders

    • S. M. L. Sastry, D. R. Frear, G. Kuo, K. L. Jerina
    Pages 299-352

  12. Back Matter

    Pages 353-356
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Keywords

About this book

In 1992 Congress passed the Defense Manufacturing Engineering Education Act with the intent of encouraging academic institutions to increase their emphasis on manufacturing curricula. The need for this incentive to integrate the academic and industrial communities was clear: gaps in manufacturing science were inhibiting the evolution of new manufacturing technologies that are required for the U.S. to maintain a competitive posture in the world marketplace. The Army Research Laboratory and Sandia National Laboratories sought to contribute to the congressional intent by initiating a new series of graduate level college textbooks. The goal was to focus next-generation scientists onto issues that were common to the needs of the commercial market, the affordability of DoD weapons systems, and the mobilization readiness of the U.S. Armed Forces. The textbook The Mechanics of Solder Wetting and Spreading was written in this spirit by nationally renowned scientists for academe and industry. Research­ ers using the book are encouraged to formulate programs that will establish scien­ tific correlations between manufacturing process controls and product reliability. Such correlations are essential to the building of a new electronics industry which is based upon the futuristic concepts of Virtual Factories, Prototyping, and Testing.

Editors and Affiliations

  • Sandia National Laboratories, Department 1831, Center for Solder Science & Technology, Albuquerque, USA

    F. G. Yost, F. M. Hosking

  • Sandia National Laboratories, Department 1832, Center for Solder Science & Technology, Albuquerque, USA

    D. R. Frear

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