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Table of contents (6 chapters)
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Front Matter
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Back Matter
About this book
Authors and Affiliations
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University of Colorado, Boulder, USA
Y. C. Lee
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IBM Corporation, Endicott, USA
W. T. Chen
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Institute of Materials Research and Engineering, Singapore
W. T. Chen
Bibliographic Information
Book Title: Manufacturing Challenges in Electronic Packaging
Authors: Y. C. Lee, W. T. Chen
DOI: https://doi.org/10.1007/978-1-4615-5803-3
Publisher: Springer New York, NY
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eBook Packages: Springer Book Archive
Copyright Information: Springer Science+Business Media Dordrecht 1998
Hardcover ISBN: 978-0-412-62030-0Published: 31 December 1997
Softcover ISBN: 978-1-4613-7659-0Published: 25 September 2012
eBook ISBN: 978-1-4615-5803-3Published: 06 December 2012
Edition Number: 1
Number of Pages: XI, 261
Topics: Industrial Chemistry/Chemical Engineering, Electronics and Microelectronics, Instrumentation, Manufacturing, Machines, Tools, Processes