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Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications

  • Book
  • © 1999

Overview

Authors:
  1. Dean L. Monthei

    1. TriQuint Semiconductor, USA

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Part of the book series: Electronic Packaging and Interconnects (EPAC, volume 2)

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Table of contents (15 chapters)

  1. Front Matter

    Pages i-xiv
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  2. High Frequency Issues

    1. Front Matter

      Pages 1-1
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    2. Tutorial on Microwave Concepts

      • Dean L. Monthei
      Pages 3-28

    3. The Smith Chart and S-Parameters

      • Dean L. Monthei
      Pages 29-41

  3. Electrical Modeling of Packages

    1. Front Matter

      Pages 43-43
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    2. Equivalent Circuit Models

      • Dean L. Monthei
      Pages 45-61

    3. Creating Models from Measurements

      • Dean L. Monthei
      Pages 63-83

    4. Creating a Model using EM Simulators

      • Dean L. Monthei
      Pages 85-120

  4. Thermal Modeling

    1. Front Matter

      Pages 121-121
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    2. Basics of Thermal Analysis

      • Dean L. Monthei
      Pages 123-131

    3. Quick Thermal Analysis

      • Dean L. Monthei
      Pages 133-140

    4. Finite Element Analysis

      • Dean L. Monthei
      Pages 141-150

    5. Computational Fluid Dynamics

      • Dean L. Monthei
      Pages 151-153

    6. Transient Thermal

      • Dean L. Monthei
      Pages 155-163

    7. Thermal Measurements

      • Dean L. Monthei
      Pages 165-170

  5. Processing Issues with Packaging GaAs High Frequency Components

    1. Front Matter

      Pages 171-171
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    2. Package Families for Wireless

      • Dean L. Monthei
      Pages 173-179

    3. Optimizing Electrical Performance

      • Dean L. Monthei
      Pages 181-190

    4. Production Process Issues

      • Dean L. Monthei
      Pages 191-205

    5. Die Attach Issues

      • Dean L. Monthei
      Pages 206-210
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Keywords

About this book

This book discusses the practical aspects of electrical and thermal modeling of packages. In addition, processing concerns for plastic packaged GaAs parts are also covered. The book emphasizes low cost industry standard packages. However, the principles involved translate well to other categories of packages. Digital issues such as crosstalk are well documented in other books and are therefore not covered in detail in this text. The principles for generation of equivalent circuit package models applies to both digital and analog parts. Digital designers and packaging engineers should still find this text useful. Subtleties often overlooked by standard methods of modeling packages for digital applications are considered and will become more important to the digital packaging engineer as frequencies continue to increase. It is hoped this book will be useful to both microwave and digital integrated circuit (Ie) designers as well as packaging engineers. In the past these disciplines were distinct. Packaging engineers typically were concerned with only materials and mechanical issues of the package. As long as there was an electrical connection made from the die to the external pin, packaging engineers had the freedom to do anything they wanted between these two points. At high frequency the issues change. Packaging engineers now have to work with die level designers to either create a package that performs well at high frequencies or to use readily available low cost packages that happen to meet the needs of the application.

Authors and Affiliations

  • TriQuint Semiconductor, USA

    Dean L. Monthei

Bibliographic Information

  • Book Title: Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications

  • Authors: Dean L. Monthei

  • Series Title: Electronic Packaging and Interconnects

  • DOI: https://doi.org/10.1007/978-1-4615-5111-9

  • Publisher: Springer New York, NY

  • eBook Packages: Springer Book Archive

  • Copyright Information: Springer Science+Business Media New York 1999

  • Hardcover ISBN: 978-0-7923-8364-2Published: 30 November 1998

  • Softcover ISBN: 978-1-4613-7325-4Published: 14 March 2014

  • eBook ISBN: 978-1-4615-5111-9Published: 27 November 2013

  • Series ISSN: 1389-2169

  • Edition Number: 1

  • Number of Pages: XIV, 234

  • Number of Illustrations: 62 b/w illustrations

  • Topics: Microwaves, RF and Optical Engineering, Control, Robotics, Mechatronics, Electrical Engineering

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