Failure Analysis of Integrated Circuits: Tools and Techniques provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits. These include applications specific to performing failure analysis such as decapsulation, deprocessing, and fail site isolation, as well as physical and chemical analysis tools and techniques. The coverage is qualitative, and it provides a general understanding for making intelligent tool choices. Also included is coverage of the shortcomings, limitations, and strengths of each technique.
Failure Analysis of Integrated Circuits: Tools and Techniques is a `must have' reference work for semiconductor professionals and researchers.

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Editors and Affiliations

Texas Instruments Incorporated, USA

Lawrence C. Wagner

Bibliographic Information

Book Title: Failure Analysis of Integrated Circuits
Book Subtitle: Tools and Techniques
Editors: Lawrence C. Wagner
Series Title: The Springer International Series in Engineering and Computer Science
DOI: https://doi.org/10.1007/978-1-4615-4919-2
Publisher: Springer New York, NY
eBook Packages: Springer Book Archive
Copyright Information: Springer Science+Business Media New York 1999
Hardcover ISBN: 978-0-412-14561-2Published: 31 January 1999
Softcover ISBN: 978-1-4613-7231-8Published: 09 November 2012
eBook ISBN: 978-1-4615-4919-2Published: 06 December 2012
Series ISSN: 0893-3405
Edition Number: 1
Number of Pages: XIII, 255
Topics: Optical and Electronic Materials, Electrical Engineering

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Table of contents (15 chapters)

Front Matter

Back Matter

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