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Solder Joint Reliability

Theory and Applications

  • Book
  • © 1991

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Editors:
  1. John H. Lau
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Table of contents (18 chapters)

  1. Front Matter

    Pages i-xxi
    Download chapter PDF

  2. Flux Reactions and Solderability

    • Colin MacKay
    Pages 1-37

  3. Solder Paste Technology and Applications

    • Jennie S. Hwang
    Pages 38-91

  4. Technical Considerations in Vapor Phase and Infrared Solder Reflow Processes

    • Charles L. Hutchins
    Pages 92-116

  5. Optimizing the Wave Soldering Process

    • Janet R. Sterritt
    Pages 117-142

  6. Post-Solder Cleaning Considerations

    • Leslie A. Guth
    Pages 143-172

  7. Scanning Electron Microscopy and Energy Dispersive X-ray (SEM/EDX) Characterization of Solder Solderability and Reliability

    • James L. Marshall
    Pages 173-224

  8. The Role of Microstructure in Thermal Fatigue of Pb-Sn Solder Joints

    • J. W. Morris Jr., D. Tribula, T. S. E. Summers, D. Grivas
    Pages 225-265

  9. Microstructure and Mechanical Properties of Solder Alloys

    • Harold J. Frost
    Pages 266-278

  10. The Interaction of Creep and Fatigue in Lead-Tin Solders

    • John K. Tien, Bryan C. Hendrix, Abbas I. Attarwala
    Pages 279-305

  11. Creep and Stress Relaxation in Solder Joints

    • Peter M. Hall
    Pages 306-332

  12. Effects of Strain Range, Ramp Time, Hold Time, and Temperature on Isothermal Fatigue Life of Tin-Lead Solder Alloys

    • Semyon Vaynman, Moris E. Fine
    Pages 333-360

  13. A Damage Integral Methodology for Thermal and Mechanical Fatigue of Solder Joints

    • Che-Yu Li, R. Subrahmanyan, J. R. Wilcox, D. Stone
    Pages 361-383

  14. Modern Approaches to Fatigue Life Prediction of SMT Solder Joints

    • Thomas J. Kilinski, Jon R. Lesniak, Bela I. Sandor
    Pages 384-405

  15. Predicting Thermal and Mechanical Fatigue Lives from Isothermal Low Cycle Data

    • Harvey D. Solomon
    Pages 406-454

  16. Static and Dynamic Analyses of Surface Mount Component Leads and Solder Joints

    • John H. Lau
    Pages 455-507

  17. Integrated Matrix Creep: Application to Accelerated Testing and Lifetime Prediction

    • Sheera Knecht, Les Fox
    Pages 508-544

  18. Solder Attachment Reliability, Accelerated Testing, and Result Evaluation

    • Werner Engelmaier
    Pages 545-587

  19. Surface Mount Attachment Reliability and Figures of Merit for Design for Reliability

    • J-P M. Clech, J. A. Augis
    Pages 588-613

  20. Back Matter

    Pages 615-631
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Keywords

About this book

Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me­ chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica­ tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo­ metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer.

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