Overview
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Table of contents (12 chapters)
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Overview
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Basic Technologies
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Methodologies and Applications
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Reliability, Quality Control and Tests
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Future Tasks and Emerging Trends
Keywords
About this book
Authors and Affiliations
Bibliographic Information
Book Title: Solder Paste in Electronics Packaging
Book Subtitle: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly
Authors: Jennie S. Hwang
DOI: https://doi.org/10.1007/978-1-4615-3528-7
Publisher: Springer New York, NY
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eBook Packages: Springer Book Archive
Copyright Information: Springer Science+Business Media New York 1992
Softcover ISBN: 978-0-442-01353-0Published: 24 September 1992
eBook ISBN: 978-1-4615-3528-7Published: 06 December 2012
Edition Number: 1
Number of Pages: XXIV, 456
Number of Illustrations: 77 b/w illustrations
Topics: Circuits and Systems, Industrial and Production Engineering, Electrical Engineering, Science, Humanities and Social Sciences, multidisciplinary