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Foldable Flex and Thinned Silicon Multichip Packaging Technology

  • Book
  • © 2003

Overview

Editors:
  1. John W. Balde
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Part of the book series: Emerging Technology in Advanced Packaging (ADEP, volume 1)

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Table of contents (14 chapters)

  1. Front Matter

    Pages i-xix
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  2. 3-D Assemblies of Stacked Chips and other Thin Packages

    • John W. Balde
    Pages 1-14

  3. Multi-Chip Carriers in a System-on-a Chip-World

    • Evan Davidson
    Pages 15-47

  4. Packaging Technologies for Flexible Systems

    • Christine Kallmayer
    Pages 49-67

  5. Low-Profile and Flexible Electronic Assemblies Using Ultra-Thin Silicon — The European FLEX-SI Project

    • Thomas Harder, Wolfgang Reinert
    Pages 69-99

  6. Thin Chips for Flexible and 3D-Integrated Electronic Systems

    • Karlheinz Bock, Michael Feil, Christof Landesberger
    Pages 101-148

  7. Flexible, Microarray Interconnection Technique Applied to Biomedical Microdevices

    • Joerg-Uwe Meyer, Martin Schuettler, Oliver Scholz, Werner Haberer, Thomas Stieglitz
    Pages 149-176

  8. Folded Flex and other Structures for System-in-a-Package

    • Mike Warner, William Carlson
    Pages 177-216

  9. Valtronic CSP3D

    • Georges Rochat, Philippe Clot, Jean-François Zeberli
    Pages 217-234

  10. 3D Packaging Technologies: Are Flex Based Solutions the Answer?

    • Ted Tessier
    Pages 235-245

  11. Availability of High Density Interconnect Flexible Circuits

    • E. Jan Vardaman, Dominique Numakura
    Pages 247-255

  12. Recent Advancements in Flex Circuit Technology Using Liquid Crystal Polymer Substrates

    • Rui Yang, Terry F. Hayden
    Pages 257-287

  13. Flex and the Interconnected Mesh Power System (IMPS)

    • Leonard W. Schaper
    Pages 289-309

  14. Thermal Management and Control of Electromagnetic Emissions

    • Carl Zweben
    Pages 311-325

  15. Conclusion

    • John W. Balde
    Pages 327-328

  16. Back Matter

    Pages 329-347
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Keywords

About this book

Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.

Reviews

"If you are responsible for deciding on the next generation of packaging that will be used for your company's application or are steering university research and want to find high impact focus, this book is a must read....By placing all this information between two covers and having the various perspectives of the many authors clash and add to each other (and providing access to the authors), the reader is placed in a knowledgeable position from which to make their own technology investment decisions in this 3D world."
(David W Palmer, Manager Microsystems Applications, Sandia National Laboratories)

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