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Packaging of High Power Semiconductor Lasers

  • Book
  • © 2015

Overview

Authors:
  1. Xingsheng Liu

    1. Xi’an Institute of Optics & Precision Mechanics, Chinese Academy of Sciences, Shaanxi, China

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  2. Wei Zhao

    1. Xi’an Institute of Optics & Precision Mechanics, Chinese Academy of Sciences, Shaanxi, China

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  3. Lingling Xiong

    1. Xi’an Institute of Optics & Precision Mechanics, Chinese Academy of Sciences, Shaanxi, China

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  4. Hui Liu

    1. Xi’an Institute of Optics & Precision Mechanics, Chinese Academy of Sciences, Shaanxi, China

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  • Describes packaging design for high power semiconductor lasers
  • Details prevention techniques for thermal stress failures
  • Discusses most recent technology trends in semiconductor laser packaging

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Table of contents (11 chapters)

  1. Front Matter

    Pages i-xv
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  2. Introduction of High Power Semiconductor Lasers

    • Xingsheng Liu, Wei Zhao, Lingling Xiong, Hui Liu
    Pages 1-28

  3. Overview of High Power Semiconductor Laser Packages

    • Xingsheng Liu, Wei Zhao, Lingling Xiong, Hui Liu
    Pages 29-52

  4. Thermal Design and Management in High Power Semiconductor Laser Packaging

    • Xingsheng Liu, Wei Zhao, Lingling Xiong, Hui Liu
    Pages 53-88

  5. Thermal Stress in High Power Semiconductor Lasers

    • Xingsheng Liu, Wei Zhao, Lingling Xiong, Hui Liu
    Pages 89-105

  6. Optical Design and Beam Shaping in High Power Semiconductor Lasers

    • Xingsheng Liu, Wei Zhao, Lingling Xiong, Hui Liu
    Pages 107-154

  7. Materials in High Power Semiconductor Laser Packaging

    • Xingsheng Liu, Wei Zhao, Lingling Xiong, Hui Liu
    Pages 155-183

  8. Packaging Process of High Power Semiconductor Lasers

    • Xingsheng Liu, Wei Zhao, Lingling Xiong, Hui Liu
    Pages 185-226

  9. Testing and Characterization of High Power Semiconductor Lasers

    • Xingsheng Liu, Wei Zhao, Lingling Xiong, Hui Liu
    Pages 227-286

  10. Failure Analysis and Reliability Assessment in High Power Semiconductor Laser Packaging

    • Xingsheng Liu, Wei Zhao, Lingling Xiong, Hui Liu
    Pages 287-314

  11. Applications of High Power Semiconductor Lasers

    • Xingsheng Liu, Wei Zhao, Lingling Xiong, Hui Liu
    Pages 315-364

  12. Development Trend and Challenges in High Power Semiconductor Laser Packaging

    • Xingsheng Liu, Wei Zhao, Lingling Xiong, Hui Liu
    Pages 365-395

  13. Back Matter

    Pages 397-402
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Keywords

About this book

This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.

Authors and Affiliations

  • Xi’an Institute of Optics & Precision Mechanics, Chinese Academy of Sciences, Shaanxi, China

    Xingsheng Liu, Wei Zhao, Lingling Xiong, Hui Liu

About the authors

Dr. Xingsheng Liu, Dr. Wei Zhao, Dr. Lingling Xiong, and Dr. Hui Liu are at the Xi’an Institute of Optics & Precision Mechanics, Chinese Academy of Sciences.

Bibliographic Information

  • Book Title: Packaging of High Power Semiconductor Lasers

  • Authors: Xingsheng Liu, Wei Zhao, Lingling Xiong, Hui Liu

  • Series Title: Micro- and Opto-Electronic Materials, Structures, and Systems

  • DOI: https://doi.org/10.1007/978-1-4614-9263-4

  • Publisher: Springer New York, NY

  • eBook Packages: Energy, Energy (R0)

  • Copyright Information: Springer Science+Business Media New York 2015

  • Hardcover ISBN: 978-1-4614-9262-7Published: 15 July 2014

  • Softcover ISBN: 978-1-4939-5590-9Published: 01 October 2016

  • eBook ISBN: 978-1-4614-9263-4Published: 14 July 2014

  • Series ISSN: 2626-2371

  • Series E-ISSN: 2626-238X

  • Edition Number: 1

  • Number of Pages: XV, 402

  • Number of Illustrations: 111 b/w illustrations, 386 illustrations in colour

  • Topics: Energy Systems

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