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Computing with Memory for Energy-Efficient Robust Systems

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  • © 2014

Overview

  • Introduces new paradigm for hardware reconfigurable frameworks, which leverages dense memory array as a malleable resource, which can be used for information storage as well as computation
  • Merges spatial and temporal computing to minimize interconnect overhead and achieve better scalability compared to state-of-the-art reconfigurable computing platforms
  • Enables efficient mapping of diverse data-intensive applications from domains of signal processing, multimedia and security applications

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Table of contents (20 chapters)

  1. Introduction

  2. Memory Based Computing: Overview

  3. Hardware Framework

  4. Software Framework

  5. MBC Design Space Exploration

Keywords

About this book

This book analyzes energy and reliability as major challenges faced by designers of computing frameworks in the nanometer technology regime.  The authors describe the existing solutions to address these challenges and then reveal a new reconfigurable computing platform, which leverages high-density nanoscale memory for both data storage and computation to maximize the energy-efficiency and reliability. The energy and reliability benefits of this new paradigm are illustrated and the design challenges are discussed. Various hardware and software aspects of this exciting computing paradigm are described, particularly with respect to hardware-software co-designed frameworks, where the hardware unit can be reconfigured to mimic diverse application behavior.  Finally, the energy-efficiency of the paradigm described is compared with other, well-known reconfigurable computing platforms.

Authors and Affiliations

  • Intel Labs, Hillsboro, USA

    Somnath Paul

  • Department of EECS, Case Western Reserve University, Cleveland, USA

    Swarup Bhunia

Bibliographic Information

  • Book Title: Computing with Memory for Energy-Efficient Robust Systems

  • Authors: Somnath Paul, Swarup Bhunia

  • DOI: https://doi.org/10.1007/978-1-4614-7798-3

  • Publisher: Springer New York, NY

  • eBook Packages: Engineering, Engineering (R0)

  • Copyright Information: Springer Science+Business Media New York 2014

  • Hardcover ISBN: 978-1-4614-7797-6

  • Softcover ISBN: 978-1-4939-4819-2

  • eBook ISBN: 978-1-4614-7798-3

  • Edition Number: 1

  • Number of Pages: XIII, 210

  • Number of Illustrations: 32 b/w illustrations, 41 illustrations in colour

  • Topics: Circuits and Systems, Electronics and Microelectronics, Instrumentation, Processor Architectures

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