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Table of contents (7 chapters)
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Front Matter
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Back Matter
About this book
Authors and Affiliations
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National Microelectronics Research Centre, University College Cork, Ireland
Gerard Kelly
Bibliographic Information
Book Title: The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages
Authors: Gerard Kelly
DOI: https://doi.org/10.1007/978-1-4615-5011-2
Publisher: Springer New York, NY
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eBook Packages: Springer Book Archive
Copyright Information: Springer Science+Business Media New York 1999
Hardcover ISBN: 978-0-7923-8485-4Published: 30 April 1999
Softcover ISBN: 978-1-4613-7276-9Published: 08 October 2012
eBook ISBN: 978-1-4615-5011-2Published: 06 December 2012
Edition Number: 1
Number of Pages: XIX, 134
Topics: Circuits and Systems, Manufacturing, Machines, Tools, Processes, Classical Mechanics, Characterization and Evaluation of Materials, Electrical Engineering