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Failure Analysis of Integrated Circuits

Tools and Techniques

  • Book
  • © 1999

Overview

Editors:
  1. Lawrence C. Wagner

    1. Texas Instruments Incorporated, USA

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Part of the book series: The Springer International Series in Engineering and Computer Science (SECS, volume 494)

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Table of contents (15 chapters)

  1. Front Matter

    Pages i-xiii
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  2. Introduction

    • Lawrence C. Wagner
    Pages 1-11

  3. Electrical Characterization

    • Steven Frank, Wilson Tan, John F. West
    Pages 13-41

  4. Package Analysis: SAM and X-ray

    • Thomas M. Moore, Cheryl D. Hartfield
    Pages 43-57

  5. Die Exposure

    • Phuc D. Ngo
    Pages 59-66

  6. Global Failure Site Isolation: Thermal Techniques

    • Daniel L. Barton
    Pages 67-86

  7. Failure Site Isolation: Photon Emission Microscopy Optical/Electron Beam Techniques

    • Edward I. Cole Jr., Daniel L. Barton
    Pages 87-112

  8. Probing Technology for IC Diagnosis

    • Christopher G. Talbot
    Pages 113-143

  9. IC Deprocessing

    • Daniel Yim
    Pages 145-157

  10. Cross-Section Analysis

    • Tim Haddock, Scott Boddicker
    Pages 159-173

  11. Inspection Techniques

    • Lawrence C. Wagner
    Pages 175-193

  12. Chemical Analysis

    • Lawrence C. Wagner
    Pages 195-203

  13. Energy Dispersive Spectroscopy

    • Phuc D. Ngo
    Pages 205-215

  14. Auger Electron Spectroscopy

    • Robert K. Lowry
    Pages 217-227

  15. Secondary Ion Mass Spectrometry, SIMS

    • Keenan Evans
    Pages 229-240

  16. FA Future Requirements

    • David P. Vallett
    Pages 241-250

  17. Back Matter

    Pages 251-255
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Keywords

About this book

Failure Analysis of Integrated Circuits: Tools and Techniques provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits. These include applications specific to performing failure analysis such as decapsulation, deprocessing, and fail site isolation, as well as physical and chemical analysis tools and techniques. The coverage is qualitative, and it provides a general understanding for making intelligent tool choices. Also included is coverage of the shortcomings, limitations, and strengths of each technique.
Failure Analysis of Integrated Circuits: Tools and Techniques is a `must have' reference work for semiconductor professionals and researchers.

Editors and Affiliations

  • Texas Instruments Incorporated, USA

    Lawrence C. Wagner

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