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Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits

  • Book
  • © 1995

Overview

Authors:
  1. Nishath K. Verghese

    1. Carnegie Mellon University, USA

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  2. Timothy J. Schmerbeck

    1. IBM. Rochester, USA

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  3. David J. Allstot

    1. Carnegie Mellon University, USA

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Part of the book series: The Springer International Series in Engineering and Computer Science (SECS, volume 302)

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Table of contents (12 chapters)

  1. Front Matter

    Pages i-xxiii
    Download chapter PDF

  2. Introduction

    • Nishath K. Verghese, Timothy J. Schmerbeck, David J. Allstot
    Pages 1-3

  3. Sources of Noise and Methods of Coupling

    • Nishath K. Verghese, Timothy J. Schmerbeck, David J. Allstot
    Pages 5-42

  4. Semiconductor Device Simulation

    • Nishath K. Verghese, Timothy J. Schmerbeck, David J. Allstot
    Pages 43-76

  5. Simplified Substrate Modeling and Rapid Simulation

    • Nishath K. Verghese, Timothy J. Schmerbeck, David J. Allstot
    Pages 77-116

  6. Mesh Generation

    • Nishath K. Verghese, Timothy J. Schmerbeck, David J. Allstot
    Pages 117-124

  7. Substrate Modeling in Heavily-Doped Bulk Processes

    • Nishath K. Verghese, Timothy J. Schmerbeck, David J. Allstot
    Pages 125-134

  8. Substrate Resistance Extraction for Large Circuits

    • Nishath K. Verghese, Timothy J. Schmerbeck, David J. Allstot
    Pages 135-148

  9. Modeling Chip/Package Power Distribution

    • Nishath K. Verghese, Timothy J. Schmerbeck, David J. Allstot
    Pages 149-182

  10. Controlling Substrate Coupling in Heavily-Doped Bulk Processes

    • Nishath K. Verghese, Timothy J. Schmerbeck, David J. Allstot
    Pages 183-215

  11. Controlling Substrate Coupling in Bulk P- Wafers

    • Nishath K. Verghese, Timothy J. Schmerbeck, David J. Allstot
    Pages 217-233

  12. Chip/Package Shielding and Good Circuit Design Practice

    • Nishath K. Verghese, Timothy J. Schmerbeck, David J. Allstot
    Pages 235-253

  13. A Design Example

    • Nishath K. Verghese, Timothy J. Schmerbeck, David J. Allstot
    Pages 255-273

  14. Back Matter

    Pages 275-280
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Keywords

Authors and Affiliations

  • Carnegie Mellon University, USA

    Nishath K. Verghese, David J. Allstot

  • IBM. Rochester, USA

    Timothy J. Schmerbeck

Bibliographic Information

  • Book Title: Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits

  • Authors: Nishath K. Verghese, Timothy J. Schmerbeck, David J. Allstot

  • Series Title: The Springer International Series in Engineering and Computer Science

  • DOI: https://doi.org/10.1007/978-1-4615-2239-3

  • Publisher: Springer New York, NY

  • eBook Packages: Springer Book Archive

  • Copyright Information: Springer Science+Business Media New York 1995

  • Hardcover ISBN: 978-0-7923-9544-7Published: 31 December 1994

  • Softcover ISBN: 978-1-4613-5942-5Published: 10 October 2012

  • eBook ISBN: 978-1-4615-2239-3Published: 06 December 2012

  • Series ISSN: 0893-3405

  • Edition Number: 1

  • Number of Pages: XXIII, 280

  • Topics: Circuits and Systems, Electrical Engineering

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