Skip to main content
SpringerLink
Log in

Structural Analysis of Printed Circuit Board Systems

  • Book
  • © 1993

Overview

Authors:
  1. Peter A. Engel

    1. Department of Mechanical and Industrial Engineering, State University of New York at Binghamton, Binghamton, USA

    View author publications

    You can also search for this author in PubMed   Google Scholar

Part of the book series: Mechanical Engineering Series (MES)

This is a preview of subscription content, log in via an institution to check access.

Access this book

Log in via an institution
eBook USD 129.00
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book USD 169.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info
Hardcover Book USD 169.99
Price excludes VAT (USA)
  • Durable hardcover edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Other ways to access

Licence this eBook for your library

Institutional subscriptions

Table of contents (14 chapters)

  1. Front Matter

    Pages i-xix
    Download chapter PDF

  2. Elements of Structural Analysis

    • Peter A. Engel
    Pages 1-20

  3. Finite Element Analysis

    • Peter A. Engel
    Pages 21-34

  4. Components, Data, and Testing

    • Peter A. Engel
    Pages 35-60

  5. Leadless Chip Carriers

    • Peter A. Engel
    Pages 61-76

  6. Thermal Stress in Pin-Grid Arrays: Primary Analysis of Pins

    • Peter A. Engel
    Pages 77-96

  7. Thermal Stress in Pin-Grid Arrays: Interaction Between Module and Circuit Card

    • Peter A. Engel
    Pages 97-115

  8. Compliant Leaded Systems: The Local Assembly

    • Peter A. Engel
    Pages 116-135

  9. Bending in Compliant Leaded Systems

    • Peter A. Engel
    Pages 136-162

  10. Approximate Engineering Theory for the Twisting of Compliant Leaded Circuit Card/Module Systems

    • Peter A. Engel
    Pages 163-178

  11. Analytical Theory and Experimental Work in Compliant Leaded Systems Subjected to Twisting

    • Peter A. Engel
    Pages 179-202

  12. Thermal Stresses in Compliant Leaded Systems

    • Peter A. Engel
    Pages 203-225

  13. Dynamic Response of Circuit Card Systems

    • Peter A. Engel
    Pages 226-242

  14. Plated Holes in Cards and Boards

    • Peter A. Engel
    Pages 243-259

  15. Assembly of Cards and Boards

    • Peter A. Engel
    Pages 260-281

  16. Back Matter

    Pages 283-291
    Download chapter PDF
Back to top

Keywords

About this book

This book discusses the building blocks of electronic circuits - the microchips, transistors, resistors, condensers, and so forth, and the boards that support them - from the point of view of mechanics: What are the stresses that result from thermal expansion and contraction? What are the elastic parameters that determine whether a component will survive a certain acceleration? After an introduction to the elements of structural analysis and finite-element analysis, the author turns to components, data and testing. A discussion of leadless chip carriers leads to a detailed thermal analysis of pin grid arrays. For compliant leaded systems, both mechanical (bending and twisting) and thermal stresses are discussed in detail. The book concludes with discussions of the dynamic response of circuit cards, plated holes in cards and boards, and the final assembly of cards and boards.

Authors and Affiliations

  • Department of Mechanical and Industrial Engineering, State University of New York at Binghamton, Binghamton, USA

    Peter A. Engel

Bibliographic Information

Publish with us

Policies and ethics

Back to top

Search

Navigation