Overview
- Provides solutions to several common reliability issues in microsystem packaging
- Teaches the reader methods to understand and predict failure mechanisms at interfaces between dissimilar materials
- Combines thermodynamic-diffusion kinetic modelling with experimental microstructural analysis
- Includes supplementary material: sn.pub/extras
Part of the book series: Microsystems (MICT)
Access this book
Tax calculation will be finalised at checkout
Other ways to access
Table of contents (6 chapters)
-
Front Matter
-
Back Matter
Keywords
About this book
Interfaces between dissimilar materials are met everywhere in microelectronics and microsystems. In order to ensure faultless operation of these highly sophisticated structures, it is mandatory to have fundamental understanding of materials and their interactions in the system. In this difficult task, the “traditional” method of trial and error is not feasible anymore; it takes too much time and repeated efforts. In Interfacial Compatibility in Microelectronics, an alternative approach is introduced.
In this revised method four fundamental disciplines are combined: i) thermodynamics of materials ii) reaction kinetics iii) theory of microstructures and iv) stress and strain analysis. The advantages of the method are illustrated in Interfacial Compatibility in Microelectronics which includes:
solutions to several common reliability issues in microsystem technology,
methods to understand and predict failure mechanisms at interfaces between dissimilar materials and
an approach to DFR based on deep understanding in materials science, rather than on the use of mechanistic tools, such as FMEA.
Interfacial Compatibility in Microelectronics provides a clear and methodical resource for graduates and postgraduates alike.
Authors and Affiliations
Bibliographic Information
Book Title: Interfacial Compatibility in Microelectronics
Book Subtitle: Moving Away from the Trial and Error Approach
Authors: Tomi Laurila, Vesa Vuorinen, Mervi Paulasto-Kröckel, Markus Turunen, Toni T. Mattila, Jorma Kivilahti
Series Title: Microsystems
DOI: https://doi.org/10.1007/978-1-4471-2470-2
Publisher: Springer London
eBook Packages: Engineering, Engineering (R0)
Copyright Information: Springer-Verlag London 2012
Hardcover ISBN: 978-1-4471-2469-6Published: 13 January 2012
Softcover ISBN: 978-1-4471-6068-7Published: 22 February 2014
eBook ISBN: 978-1-4471-2470-2Published: 10 January 2012
Series ISSN: 1389-2134
Edition Number: 1
Number of Pages: X, 218
Topics: Nanotechnology and Microengineering, Surfaces and Interfaces, Thin Films, Optical and Electronic Materials