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Built-in-Self-Test and Digital Self-Calibration for RF SoCs

  • Book
  • © 2012

Overview

Authors:
  1. Sleiman Bou-Sleiman

    1. The Ohio State University, Columbus, USA

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    You can also search for this author in PubMed   Google Scholar

  2. Mohammed Ismail

    1. , Dpt. of Electrical & Computer Engineerin, The Ohio State University, Columbus, USA

    View author publications

    You can also search for this author in PubMed   Google Scholar

  • Applies Built-in-Self-Test (Bi. ST) and Built-in-Self-Calibration (Bi.
  • SC) to real applications in nanometer wireless radio design Provides on-chip testing capabilities as well as on-the-fly calibration abilities to render mixed-mode designs robust from the outset Reduces significantly high volume test costs of RF and mm.

Part of the book series: SpringerBriefs in Electrical and Computer Engineering (BRIEFSELECTRIC)

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Table of contents (6 chapters)

  1. Front Matter

    Pages i-xvii
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  2. Introduction and Motivation

    • Sleiman Bou-Sleiman, Mohammed Ismail
    Pages 1-12

  3. Radio Systems Overview: Architecture, Performance, and Built-in-Test

    • Sleiman Bou-Sleiman, Mohammed Ismail
    Pages 13-34

  4. Efficient Testing for RF SoCs

    • Sleiman Bou-Sleiman, Mohammed Ismail
    Pages 35-55

  5. RF Built-in-Self-Test

    • Sleiman Bou-Sleiman, Mohammed Ismail
    Pages 57-71

  6. RF Built-in-Self-Calibration

    • Sleiman Bou-Sleiman, Mohammed Ismail
    Pages 73-86

  7. Conclusions

    • Sleiman Bou-Sleiman, Mohammed Ismail
    Pages 87-89
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Keywords

About this book

This book will introduce design methodologies, known as Built-in-Self-Test (BiST) and Built-in-Self-Calibration (BiSC), which enhance the robustness of radio frequency (RF) and millimeter wave (mmWave) integrated circuits (ICs). These circuits are used in current and emerging communication, computing, multimedia and biomedical products and microchips. The design methodologies presented will result in enhancing the yield (percentage of working chips in a high volume run) of RF and mmWave ICs which will enable successful manufacturing of such microchips in high volume. 

Authors and Affiliations

  • The Ohio State University, Columbus, USA

    Sleiman Bou-Sleiman

  • , Dpt. of Electrical & Computer Engineerin, The Ohio State University, Columbus, USA

    Mohammed Ismail

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