Overview
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Table of contents (6 chapters)
Keywords
About this book
-Novel insights into fundamental relationships between dielectric constant and the breakdown field of materials and related capacitance density and breakdown voltage of capacitor structures,
-Electrical characterization techniques for a wide range of frequencies (1 kHz to 20 GHz),
-Process modeling to determine stable operating points,
-Prevention of metal (Cu) diffusion into the dielectric,
-Measurements and modeling of the dielectric micro-roughness.
Authors and Affiliations
Bibliographic Information
Book Title: Thin-Film Capacitors for Packaged Electronics
Authors: Pushkar Jain, Eugene J. Rymaszewski
DOI: https://doi.org/10.1007/978-1-4419-9144-7
Publisher: Springer New York, NY
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eBook Packages: Springer Book Archive
Copyright Information: Springer Science+Business Media New York 2004
Hardcover ISBN: 978-1-4020-7705-0Published: 30 November 2003
Softcover ISBN: 978-1-4613-4808-5Published: 23 February 2014
eBook ISBN: 978-1-4419-9144-7Published: 27 June 2011
Edition Number: 1
Number of Pages: XV, 158
Number of Illustrations: 41 b/w illustrations
Topics: Manufacturing, Machines, Tools, Processes, Theoretical and Computational Chemistry, Electrical Engineering, Optical and Electronic Materials