Advanced Materials for Thermal Management of Electronic Packaging

1. Front Matter

   Pages i-xxi

   PDF

2. Thermal Management Fundamentals and Design Guides in Electronic Packaging

   • Xingcun Colin Tong

   Pages 1-58

3. Characterization Methodologies of Thermal Management Materials

   • Xingcun Colin Tong

   Pages 59-129

4. Electronic Packaging Materials and Their Functions in Thermal Managements

   • Xingcun Colin Tong

   Pages 131-167

5. Monolithic Carbonaceous Materials and Carbon Matrix Composites

   • Xingcun Colin Tong

   Pages 169-200

6. Thermally Conductive Polymer Matrix Composites

   • Xingcun Colin Tong

   Pages 201-232

7. High Thermal Conductivity Metal Matrix Composites

   • Xingcun Colin Tong

   Pages 233-276

8. Thermally Conductive Ceramic Matrix Composites

   • Xingcun Colin Tong

   Pages 277-304

9. Thermal Interface Materials in Electronic Packaging

   • Xingcun Colin Tong

   Pages 305-371

10. Materials and Design for Advanced Heat Spreader and Air Cooling Heat Sinks

    • Xingcun Colin Tong

    Pages 373-420

11. Liquid Cooling Devices and Their Materials Selection

    • Xingcun Colin Tong

    Pages 421-475

12. Thermoelectric Cooling Through Thermoelectric Materials

    • Xingcun Colin Tong

    Pages 477-525

13. Development and Application of Advanced Thermal Management Materials

    • Xingcun Colin Tong

    Pages 527-593

14. Back Matter

    Pages 595-616

    PDF

The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.

• Thermal managing design guide
• Thermal managing fundamentals
• Thermally conductive materials
• Thermoelectric materials
• electronic packaging design
• electronic packaging materials
• electronics cooling devices
• thermal materials applications
• thermal materials development book

• Laird Technologies, Schaumburg, USA

  Xingcun Colin Tong

Policies and ethics