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Advanced Materials for Thermal Management of Electronic Packaging

  • Book
  • © 2011

Overview

Authors:
  1. Xingcun Colin Tong

    1. Laird Technologies, Schaumburg, USA

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  • Covers ceramics and glasses, polymers, metals, metallic composites, multi-material laminates, carbonaceous materials, and carbon-matrix composites
  • Provides the reader with a comprehensive understanding of thermal management solutions
  • Includes fundamentals of heat transfer and materials characterization techniques
  • Assesses cost and performance in thermal management
  • Includes supplementary material: sn.pub/extras

Part of the book series: Springer Series in Advanced Microelectronics (MICROELECTR., volume 30)

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Table of contents (12 chapters)

  1. Front Matter

    Pages i-xxi
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  2. Thermal Management Fundamentals and Design Guides in Electronic Packaging

    • Xingcun Colin Tong
    Pages 1-58

  3. Characterization Methodologies of Thermal Management Materials

    • Xingcun Colin Tong
    Pages 59-129

  4. Electronic Packaging Materials and Their Functions in Thermal Managements

    • Xingcun Colin Tong
    Pages 131-167

  5. Monolithic Carbonaceous Materials and Carbon Matrix Composites

    • Xingcun Colin Tong
    Pages 169-200

  6. Thermally Conductive Polymer Matrix Composites

    • Xingcun Colin Tong
    Pages 201-232

  7. High Thermal Conductivity Metal Matrix Composites

    • Xingcun Colin Tong
    Pages 233-276

  8. Thermally Conductive Ceramic Matrix Composites

    • Xingcun Colin Tong
    Pages 277-304

  9. Thermal Interface Materials in Electronic Packaging

    • Xingcun Colin Tong
    Pages 305-371

  10. Materials and Design for Advanced Heat Spreader and Air Cooling Heat Sinks

    • Xingcun Colin Tong
    Pages 373-420

  11. Liquid Cooling Devices and Their Materials Selection

    • Xingcun Colin Tong
    Pages 421-475

  12. Thermoelectric Cooling Through Thermoelectric Materials

    • Xingcun Colin Tong
    Pages 477-525

  13. Development and Application of Advanced Thermal Management Materials

    • Xingcun Colin Tong
    Pages 527-593

  14. Back Matter

    Pages 595-616
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Keywords

About this book

The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.

Authors and Affiliations

  • Laird Technologies, Schaumburg, USA

    Xingcun Colin Tong

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