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Cloud Connectivity and Embedded Sensory Systems

  • Book
  • © 2011

Overview

  • Offers readers a single-source entry into the world of intelligent, embedded sensor networks
  • Presents sensor networks in the context of “cloud computing”;
  • Focuses on topological and communication constraints, while adding intelligence, security and safety to the overall desired system functionality
  • Distinguishes between cloud, swarm and flock computing, in order to make the extended network more intelligent and therefore less dependent on the quality of the individual sensors

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Table of contents (8 chapters)

  1. Clouds into the Sensors’ Edge

  2. Cloud-Centric Systems

  3. Everything-in-the-Cloud

  4. Last-Mile-from-the-Cloud

Keywords

About this book

Sensor networks are meant to create awareness in space and time. They may be measuring the presence of an object or a condition, characterizing an object stream or a situational pattern, or even detect abnormalities that are to occur. This book provides new theory on the design of wireless sensor networks, based on concepts developed for large-scale, distributed computing environments known as “cloud computing.” It provides a single-source entry into the world of intelligent sensory networks, with a step-by-step discussion of building case studies that capture the requirements, taking into account practical limitations of creating ambient intelligence. The reader will not only achieve a better understanding of sensory clouds, swarms and flocks but is also guided by examples of how to design such networks taking the typical characteristics of diverse application areas into account.

Authors and Affiliations

  • Inst. Applied Technology, Dept. Electrical & Information, Lund University, Lund, Sweden

    Lambert Spaanenburg

  • Heterogeneous Computing, LLC, Durham, USA

    Hendrik Spaanenburg

Bibliographic Information

  • Book Title: Cloud Connectivity and Embedded Sensory Systems

  • Authors: Lambert Spaanenburg, Hendrik Spaanenburg

  • DOI: https://doi.org/10.1007/978-1-4419-7545-4

  • Publisher: Springer New York, NY

  • eBook Packages: Engineering, Engineering (R0)

  • Copyright Information: Springer Science+Business Media, LLC 2011

  • Hardcover ISBN: 978-1-4419-7544-7

  • Softcover ISBN: 978-1-4899-8191-2

  • eBook ISBN: 978-1-4419-7545-4

  • Edition Number: 1

  • Number of Pages: XXIII, 285

  • Topics: Circuits and Systems, Computer-Aided Engineering (CAD, CAE) and Design

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