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Ultra-thin Chip Technology and Applications

  • Book
  • © 2011

Overview

Editors:
  1. Joachim Burghartz

    1. (IMS CHIPS), Institut für Mikroelektronik Stuttgart, Stuttgart, Germany

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  • Provides a comprehensive overview of the challenges in ultra-thin chip fabrication, post processing, properties and applications by leaders in the field sharing their newest results and ideas;
  • Compares strengths and weaknesses of three leading, generic fabrication processes for ultra-thin chips;
  • Describes electronic, mechanical, optical, and thermal properties of ultra-thin chips that are different from those of conventional, thick chips
  • Includes supplementary material: sn.pub/extras

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Table of contents (34 chapters)

  1. Front Matter

    Pages i-xxii
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  2. From Thick Wafers to Ultra-Thin Silicon Chips

    1. Front Matter

      Pages 1-1
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    2. Why Are Silicon Wafers as Thick as They Are?

      • Peter Stallhofer
      Pages 3-12

    3. Thin Chips on the ITRS Roadmap

      • Joachim N. Burghartz
      Pages 13-18

  3. Thin Chip Fabrication Technologies

    1. Front Matter

      Pages 19-20
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    2. Thin Wafer Manufacturing and Handling Using Low Cost Carriers

      • Florian Schmitt, Michael Zernack
      Pages 21-32

    3. Ultra-thin Wafer Fabrication Through Dicing-by-Thinning

      • Christof Landesberger, Sabine Scherbaum, Karlheinz Bock
      Pages 33-43

    4. Thin Wafer Handling and Processing without Carrier Substrates

      • Yoshikazu Kobayashi, Martin Plankensteiner, Midoriko Honda
      Pages 45-51

    5. Epitaxial Growth and Selective Etching Techniques

      • Evangelos A. Angelopoulos, Alexander Kaiser
      Pages 53-60

    6. Silicon-on-Insulator (SOI) Wafer-Based Thin-Chip Fabrication

      • Joachim N. Burghartz
      Pages 61-67

    7. Fabrication of Ultra-thin Chips Using Silicon Wafers with Buried Cavities

      • Martin Zimmermann, Joachim N. Burghartz, Wolfgang Appel, Christine Harendt
      Pages 69-77

  4. Add-on Processing

    1. Front Matter

      Pages 79-80
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    2. Through-Silicon Vias Using Bosch DRIE Process Technology

      • Franz Laermer, Andrea Urban
      Pages 81-91

    3. Through-Silicon via Technology for 3D IC

      • Eric Beyne
      Pages 93-108

    4. 3D-IC Technology Using Ultra-Thin Chips

      • Mitsumasa Koyanagi
      Pages 109-123

    5. Substrate Handling Techniques for Thin Wafer Processing

      • Christof Landesberger, Sabine Scherbaum, Karlheinz Bock
      Pages 125-138

  5. Assembly and Embedding of Ultra-Thin Chips

    1. Front Matter

      Pages 139-140
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    2. System-in-Foil Technology

      • Andreas Dietzel, Jeroen van den Brand, Jan Vanfleteren, Wim Christiaens, Erwin Bosman, Johan De Baets
      Pages 141-157

    3. Chip Embedding in Laminates

      • Andreas Kugler, Metin Koyuncu, André Zimmermann, Jan Kostelnik
      Pages 159-165

    4. Handling of Thin Dies with Emphasis on Chip-to-Wafer Bonding

      • Fabian Schnegg, Hannes Kostner, Gernot Bock, Stefan Engensteiner
      Pages 167-183
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Keywords

About this book

Ultra-thin chips are the "smart skin" of a conventional silicon chip. This book shows how very thin and flexible chips can be fabricated and used in many new applications in microelectronics, Microsystems, biomedical and other fields. It provides a comprehensive reference to the fabrication technology, post processing, characterization and the applications of ultra-thin chips.

Editors and Affiliations

  • (IMS CHIPS), Institut für Mikroelektronik Stuttgart, Stuttgart, Germany

    Joachim Burghartz

Bibliographic Information

  • Book Title: Ultra-thin Chip Technology and Applications

  • Editors: Joachim Burghartz

  • DOI: https://doi.org/10.1007/978-1-4419-7276-7

  • Publisher: Springer New York, NY

  • eBook Packages: Engineering, Engineering (R0)

  • Copyright Information: Springer Science+Business Media, LLC 2011

  • Hardcover ISBN: 978-1-4419-7275-0

  • Softcover ISBN: 978-1-4939-5118-5

  • eBook ISBN: 978-1-4419-7276-7

  • Edition Number: 1

  • Number of Pages: XXII, 467

  • Topics: Circuits and Systems, Computer-Aided Engineering (CAD, CAE) and Design

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