Reliability Physics and Engineering

1. Front Matter

   Pages i-xiii

   PDF

2. Introduction

   • J.W. McPherson

   Pages 1-3

3. Materials and Device Degradation

   • J.W. McPherson

   Pages 5-28

4. From Material/Device Degradation to Time-To-Failure

   • J.W. McPherson

   Pages 29-35

5. Time-To-Failure Modeling

   • J.W. McPherson

   Pages 37-50

6. Gaussian Statistics — An Overview

   • J.W. McPherson

   Pages 51-61

7. Time-To-Failure Statistics

   • J.W. McPherson

   Pages 63-77

8. Failure Rate Modeling

   • J.W. McPherson

   Pages 79-93

9. Accelerated Degradation

   • J.W. McPherson

   Pages 95-107

10. Acceleration Factor Modeling

    • J.W. McPherson

    Pages 109-119

11. Ramp-to-Failure Testing

    • J.W. McPherson

    Pages 121-136

12. Time-To-Failure Models for Selected Failure Mechanisms in Integrated Circuits

    • J.W. McPherson

    Pages 137-197

13. Time-To-Failure Models for Selected Failure Mechanisms in Mechanical Engineering

    • J.W. McPherson

    Pages 199-272

14. Conversion of Dynamical Stresses into Effective Static Values

    • J.W. McPherson

    Pages 273-298

15. Increasing the Reliability of Device/Product Designs

    • J.W. McPherson

    Pages 299-310

16. Erratum to: Materials and Device Degradation

    • J.W. McPherson

    Pages 310-311

17. Back Matter

    Pages 311-318

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All engineers could bene?t from at least one course in reliability physics and engineering. It is very likely that, starting with your very ?rst engineering po- tion, you will be asked — how long is your newly developed device expected to last? This text was designed to help you to answer this fundamentally important question. All materials and devices are expected to degrade with time, so it is very natural to ask — how long will the product last? The evidence for material/device degradation is apparently everywhere in nature. A fresh coating of paint on a house will eventually crack and peel. Doors in a new home can become stuck due to the shifting of the foundation. The new ?nish on an automobile will oxidize with time. The tight tolerances associated with ?nely meshed gears will deteriorate with time. Critical parameters associated with hi- precision semiconductor devices (threshold voltages, drive currents, interconnect resistances, capacitor leakages, etc.) will degrade with time. In order to und- stand the lifetime of the material/device, it is important to understand the reliability physics (kinetics) for each of the potential failure mechanisms and then be able to develop the required reliability engineering methods that can be used to prevent, or at least minimize the occurrence of, device failure.

• Burnin and Defect Elimination
• Failure Rate Reduction
• Time-To
• Time-To-Failure Modeling
• design
• development
• electrical engineering
• integrated circuit
• materials
• materials science
• mechanical engineering
• modeling
• reliability
• reliability engineering
• quality control, reliability, safety and risk

• IEEE Fellow, Plano, USA

  J.W. McPherson

Dr. J.W. McPherson is a Texas Instruments Senior Fellow Emeritus and an IEEE Fellow. He has published approximately 200 papers on Reliability Physics and Engineering, written Reliability Chapters in four books, holds 12 patents and was a past General Chair of the International Reliability Physics Symposium. McPherson's broad reliability experience, with both electrical and mechanical failure mechanisms, makes him ideally suited to author a general textbook on Reliability Physics and Engineering.

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